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Mechanical properties of brazed ultra-thin GH99 honeycomb sandwich structure
LIU Yazhou, SONG Xiaoguo, CHENG Weiwei, HU Shengpeng, CAO Jian
2022, 43(11): 1-7. DOI: 10.12073/j.hjxb.20220706001
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2022, 43(11): 1-4.
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2022-11 Abstract
2022, 43(11): 1-8.
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Reactive air brazing of BaCe0.7Zr0.1Y0.1Yb0.1O3-δ proton conductive ceramic and stainless steel
SI Xiaoqing, SU Yi, LI Chun, QI Junlei, CAO Jian
2022, 43(11): 8-14. DOI: 10.12073/j.hjxb.20220706003
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Application status of spark plasma sintering technology in the field of material joining
LIN Panpan, LIN Jincheng, YU Di, LIN Tiesong, HE Peng
2022, 43(11): 15-21. DOI: 10.12073/j.hjxb.20220710003
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Process and properties of SiC brazing through multicomponent oxide assisted by electrothermal shock
YAN Yaotian, LIU Baishen, CAO Jian, QI Junlei
2022, 43(11): 22-29. DOI: 10.12073/j.hjxb.20220707001
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Solidification crack sensitivity of GH2132 superalloy deposited metal
GUO Xiao, XU Kai, WEI Chao, HAN Ying, LV Xiaochun
2022, 43(11): 30-35, 125. DOI: 10.12073/j.hjxb.20220623002
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Microstructure and properties of dual-wire arc additive manufacturing of Al-Mg-Zn-Cu-Sc alloy
LIN Sanbao, XIA Yunhao, DONG Bolun, CAI Xiaoyu, FAN Chenglei
2022, 43(11): 36-42. DOI: 10.12073/j.hjxb.20220710001
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Microstructure and performance analysis of laser-MIG hybrid welding joints of aluminum alloy with multi-stranded wire
XU Kai, WU Pengbo, LI Linlin, HUANG Ruisheng, LIANG Xiaomei, LIANG Yu
2022, 43(11): 43-49. DOI: 10.12073/j.hjxb.20210813001
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Influence of circular oscillating laser on the melt flow behavior during 5A06 aluminum alloy laser welding
GONG Jianfeng, LI Liqun, MENG Shenghao
2022, 43(11): 50-55, 83. DOI: 10.12073/j.hjxb.20220707002
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Effect of welding speed on material flow, microstructure and mechanical properties of BT-FSW 2219 aluminum alloy joints
ZOU Yangfan, LI Wenya, CHU Qiang, SU Yu
2022, 43(11): 56-62. DOI: 10.12073/j.hjxb.20220706002
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Aluminum alloy friction stir additive manufacturing technique with continuous feedstocks
CHEN Huizi, MENG Xiangchen, CHEN Jialin, XIE Yuming, ZHAO Yaobang, HUANG Yongxian
2022, 43(11): 63-67. DOI: 10.12073/j.hjxb.20220710002
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Effect of wire current on microstructure and properties of 7075-T6 aluminum alloy joint welded by double-wire pulsed cold metal transition method
ZHANG Zehua, LI Xiaoqiang, ZHU Dezhi, QU Shengguan, WANG Xuecheng
2022, 43(11): 68-77. DOI: 10.12073/j.hjxb.20220703002
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Characteristics of state change of powder particles under laser irradiation
YANG Yicheng, XU Fujia, HUANG Ruisheng, JIANG Bao, WU Pengbo, DU Bing
2022, 43(11): 78-83. DOI: 10.12073/j.hjxb.20220515001
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Research on fatigue performance test method of welding structure of floating platform in deep water
XU Lianyong, PENG Chentao, ZHAO Lei, HAN Yongdian, FENG Chao
2022, 43(11): 84-90. DOI: 10.12073/j.hjxb.20220703001
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Online prediction of resistance spot weld quality and model explanation under fluctuating conditions
LV Tianle, QI Miaomiao, YAN Dejun, LI Shuhua, XIA Yujun, LI Yongbing
2022, 43(11): 91-100. DOI: 10.12073/j.hjxb.20220702002
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Research on service life prediction of closely spaced array hole column laminated cooling structure
LI Chengkun, DONG Zhibo, WANG Han, HAN Fang, TENG Junfei, LV Yanlong
2022, 43(11): 101-106. DOI: 10.12073/j.hjxb.20220707003
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Study on real-time imaging detection of bonding defects by acoustic impedance method
CHI Dazhao, GUO Tao, ZHANG Runqi, ZHANG Tao, SHEN Hao
2022, 43(11): 107-111. DOI: 10.12073/j.hjxb.20220702001
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Research progress of low-temperature Cu-Cu bonding technology for advanced packaging
WANG Shuaiqi, ZOU Guisheng, LIU Lei
2022, 43(11): 112-125. DOI: 10.12073/j.hjxb.20220703003
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Research progress on micro/nano joining technologies and failure behaviors in electronic packaging
YANG Dongsheng, ZHANG He, FENG Jiayun, SA Zicheng, WANG Chenxi, TIAN Yanhong
2022, 43(11): 126-136. DOI: 10.12073/j.hjxb.20220702003
[Abstract] [FullText HTML] [PDF]
Research progress of low-temperature sintering nano silver paste
YANG Wanchun, HU Shaowei, ZHU Wenbo, LI Mingyu
2022, 43(11): 137-146. DOI: 10.12073/j.hjxb.20220708003
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Current status and prospect of preparation of nano-copper based flexible conductive films
HUANG Yongde, PENG Peng, GUO Wei, ZHOU Xingwen, CHENG Guowen, LIU Qiang
2022, 43(11): 147-156. DOI: 10.12073/j.hjxb.20220709002
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Effect of Bi addition on interfacial microstructures and properties of Sn-1.0Ag-0.5Cu Pb-free solder joints during isothermal aging and thermal cycling
YANG Weiran, JI Tongtong, DING Yu, WANG Fengjiang
2022, 43(11): 157-162. DOI: 10.12073/j.hjxb.20220709003
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