Effect of Bi addition on interfacial microstructures and properties of Sn-1.0Ag-0.5Cu Pb-free solder joints during isothermal aging and thermal cycling

YANG Weiran; JI Tongtong; DING Yu; WANG Fengjiang

doi:10.12073/j.hjxb.20220709003

TRANSACTIONS OF THE CHINA WELDING INSTITUTION > 2022 > 43(11): 157-162. > DOI: 10.12073/j.hjxb.20220709003

YANG Weiran, JI Tongtong, DING Yu, WANG Fengjiang. Effect of Bi addition on interfacial microstructures and properties of Sn-1.0Ag-0.5Cu Pb-free solder joints during isothermal aging and thermal cycling[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(11): 157-162. DOI: 10.12073/j.hjxb.20220709003

Citation:

PDF (1855 KB)

Effect of Bi addition on interfacial microstructures and properties of Sn-1.0Ag-0.5Cu Pb-free solder joints during isothermal aging and thermal cycling

Jiangsu University of Science and Technology, Zhenjiang, 212000, China

More Information

Received Date: July 08, 2022
Available Online: November 06, 2022

Graphical Abstract

Abstract

Abstract

Effect of Bi addition into Sn-1.0Ag-0.5Cu (SAC105) Pb-free solder on the interfacial microstructural evolution in BGA solder joints was studied, and the shear properties of solder joints during isothermal aging and thermal cycling were analyzed The results showed that 2wt.% Bi addition into SAC105 depressed the growth intermetallic compound (IMC) thickness at the interface of solder joints during thermal cycling, and also depressed the breaking of interfacial IMC layer caused by thermal mismatch of solder joints during the thermal cycle. However, Bi addition can also increase the shear strength of SAC105 solder joints during thermal cycling or isothermal aging, while the effect of thermal cycling treatment on shear properties on SAC105-2Bi solder joints is little. Compared with SAC105 solder joints, Bi addition changed the failure mode from ductile to brittle mode of SAC105-2Bi solder joints during thermal conditions. Therefore, Bi addition decreased the thermal cycling reliability of SAC105 solder joints.
- Pb-free solder,
- bismuth,
- isothermal aging,
- thermal cycling,
- intermetallic compound

FullText(HTML)

References (19)

References

Terashima S, Kariya Y, Hosoi T, et al. Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects[J]. Journal of Electronic Materials, 2003, 32(12): 1527 − 1533. doi: 10.1007/s11664-003-0125-z

Shnawah A A, Said S, Sabri M, et al. Microstructure, mechanical, and thermal properties of the Sn-1Ag-0.5Cu solder alloy bearing Fe for electronics applications[J]. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 2012, 551: 160 − 168. doi: 10.1016/j.msea.2012.04.115

El-Daly A A, Fawzy A, Mansour S F, et al. Thermal analysis and mechanical properties of Sn-1.0Ag-0.5Cu solder alloy after modification with SiC nano-sized particles[J]. Journal of Materials Science: Materials in Electronics, 2013, 24(8): 2976 − 2988. doi: 10.1007/s10854-013-1200-8

Qu J F , Xu J, Hu Q, et al. Modification of Sn-1.0Ag-0.5Cu solder using nickel and boron[J]. Rare Metals, 2015, 34(11): 783 − 788. doi: 10.1007/s12598-014-0221-7

王丽凤, 孙凤莲, 刘晓晶, 等. Sn-Ag-Cu-Bi钎料合金设计与组织性能分析[J]. 焊接学报, 2008, 29(7): 9 − 12. doi: 10.3321/j.issn:0253-360X.2008.07.003

Wang Lifeng, Sun Fenglian, Liu Xiaojing, et al. Design of Sn-Ag-Cu-Bi solder alloy and analysis on microstructure and properties[J]. Transactions of the China Welding Institution, 2008, 29(7): 9 − 12. doi: 10.3321/j.issn:0253-360X.2008.07.003

Wen Y N, Zhao X C, Chen Z, et al. Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO₂ nanoparticles[J]. Journal of Alloys and Compounds, 2017, 696: 799 − 807. doi: 10.1016/j.jallcom.2016.12.037

Shnawah A A, Sabri M F M, Badruddin I A, et al. The bulk alloy microstructure and mechanical properties of Sn-1Ag-0.5Cu-xAl solders (x=0, 0.1 and 0.2 wt. %)[J]. Journal of Materials Science Materials in Electronics, 2012, 23(11): 1988 − 1997. doi: 10.1007/s10854-012-0692-y

Cheng H K, Huang C W, Lee H, et al. Interfacial reactions between Cu and SnAgCu solder doped with minor Ni[J]. Journal of Alloys and Compounds, 2015, 622: 529 − 534. doi: 10.1016/j.jallcom.2014.10.121

Leong Y M, Haseeb A. Soldering characteristics and mechanical properties of Sn-1.0Ag-0.5Cu solder with minor aluminum addition[J]. Materials, 2016, 9(7): 522. doi: 10.3390/ma9070522

吴洁, 薛松柏, 于志浩, 等. Nd对Sn-3.8Ag-0.7Cu/Cu焊点高温可靠性的影响[J]. 焊接学报, 2021, 42(7): 9 − 13. doi: 10.12073/j.hjxb.20201211002

Wu Jie, Xue Songbai, Yu Zhihao, et al. Effect of Nd on the high temperature reliability of Sn-3.8Ag-0.7Cu/Cu solder joint[J]. Transactions of the China Welding Institution, 2021, 42(7): 9 − 13. doi: 10.12073/j.hjxb.20201211002

梁伟良, 薛鹏, 何鹏, 等. 超低银SAC钎料焊点界面显微组织演化[J]. 焊接学报, 2018, 39(11): 39 − 42. doi: 10.12073/j.hjxb.2018390269

Liang Weiliang, Xue Peng, He Peng, et al. Microstructures evolution of low silver SnAgCu solder joint[J]. Transactions of the China Welding Institution, 2018, 39(11): 39 − 42. doi: 10.12073/j.hjxb.2018390269

Leong Y M, Haseeb A, Nishikawa H, et al. Microstructure and mechanical properties of Sn-1.0Ag-0.5Cu solder with minor Zn additions[J]. Journal of Materials Science Materials in Electronics, 2019, 30(13): 11914 − 11922. doi: 10.1007/s10854-019-01532-5

Mandavifard M H, Sabri M, Said S M, et al. High stability and aging resistance Sn-1Ag-0.5Cu solder alloy by Fe and Bi minor alloying[J]. Microelectronic Engineering, 2019, 208: 29 − 38. doi: 10.1016/j.mee.2019.01.011

孟涛, 杨莉. Bi元素对SAC305钎料合金组织和性能的影响[J]. 热加工工艺, 2015, 44(7): 209 − 211. doi: 10.14158/j.cnki.1001-3814.2015.07.062

Meng Tao, Yang Li. Effect of Bi element on microstructure and property of SAC305 solder alloy[J]. Hot Working Technology, 2015, 44(7): 209 − 211. doi: 10.14158/j.cnki.1001-3814.2015.07.062

Chen Y, Meng Z C, Gao L Y, et al. Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints[J]. Journal of Materials Science: Materials in Electronics, 2021, 32(2): 2172 − 2186. doi: 10.1007/s10854-020-04982-4

Waduge G D, Baty G, Lee Y, et al. Isothermal aging effect on Sn-58Bi solder interconnect mechanical shear stability[J]. Journal of Electronic Materials, 2022, 51(3): 1169 − 1179. doi: 10.1007/s11664-021-09379-5

Shang P J, Liu Z Q, Li D X, et al. Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints[J]. Scripta Materialia, 2008, 58(5): 409 − 412. doi: 10.1016/j.scriptamat.2007.10.025

Liu C Z, Zhang W. Bismuth redistribution induced by intermetallic compound growth in SnBi/Cu microelectronic interconnect[J]. Journal of Materials Science, 2009, 44(1): 149 − 153. doi: 10.1007/s10853-008-3118-8

Kang T Y, Xiu Y Y, Liu C Z, et al. Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect[J]. Journal of Alloys and Compounds, 2011, 509(5): 1785 − 1789. doi: 10.1016/j.jallcom.2010.10.040

[1]	LIU Wenjing, HU Jianhua, ZHANG Yikun, XIE Zuopeng. Effect of field-shaper structure on magnetic pulse-assisted semi-solid brazing process of Cu/Al tubes joining[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2025, 46(1): 59-68. DOI: 10.12073/j.hjxb.20231221001
[2]	YU Zhangqin, HU Jianhua, YANG Zheng, HUANG Shangyu. Interfacial diffusion process of Cu/Al magnetic pulse semi-solid assisted brazing[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(4): 120-128. DOI: 10.12073/j.hjxb.20211221001
[3]	DENG Lingbo, HUANG Shangyu, YANG Mei, QIAN Dongsheng, FENG Ke, OU Bing. Effect of field shaper structure on microstructure and properties of magnetic pulse assisted semi-solid brazing joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(1): 48-54. DOI: 10.12073/j.hjxb.20210513001
[4]	LI Juan, QIN Qingdong, LONG Qiong, ZHANG Yingzhe. Influence of the filler metals' forms on semi-solid pressure reaction brazing joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(9): 139-144. DOI: 10.12073/j.hjxb.2019400250
[5]	YANG Jingwei1, CAO Biao2, LU Qinghua1. Investigation on the interfacial behavior of hybrid ultrasonic resistance welding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(3): 26-30. DOI: 10.12073/j.hjxb.2018390062
[6]	ZHANG Qingke, ZHONG Sujuan, ZHANG Lei, LONG Weimin, WANG Dezhi. Investigation on interfacial reaction behavior of brazed joint of austenitic stainless steel/Cu filler metal[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(3): 75-78.
[7]	WANG Chenxi, AN Rong, TIAN Yanhong, WANG Chunqing. Interfacial behavior between silver-plated copper wire and PCB pad during parallel micro gap welding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(11): 55-58.
[8]	LÜ Shixiong, CUI Qinglong, HUANG Yongxian, JING Xiaojun. Analysis of interface fracture behavior of arc fusion-brazed joint between titanium and aluminum dissimilar alloys[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (6): 33-36.
[9]	XU Huibin, YAN Jiuchun, LI Dachen, YANG Shiqin. Semi-solid vibration diffusion brazing of SiC_p ZL101A composites[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (5): 13-17.
[10]	LIU Jun-hong, SUN Kang-ning, GONG Hong-yu, TAN Xun-yan. Interfacial microstructure of Al₂O₃-based ceramic composite/steel joint by brazing in air[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2003, (6): 26-28.

Cited By

Cited by

Periodical cited type(2)

1.	曾邦兴，胡永俊，邹晓东，牛犇，易江龙. 保护气体对(Nb, Ti)C增强铁基复合堆焊层组织与性能的影响. 焊接. 2022(06): 33-41 .
2.	魏炜，黄智泉，杨威，张海燕. Fe/C配比对等离子堆焊Fe-Cr-C合金组织及性能的影响. 电焊机. 2022(11): 37-42 .

Other cited types(3)

Get Citation

PDF

XML

Article views (374) PDF downloads (59) Cited by(5)

Turn off MathJax

Article Contents

Abstract

References

Effect of Bi addition on interfacial microstructures and properties of Sn-1.0Ag-0.5Cu Pb-free solder joints during isothermal aging and thermal cycling