Current status and prospect of preparation of nano-copper based flexible conductive films

Nano-copper based flexible conductive films exhibit attracting prospects for applications in next- generation flexible devices owing to the high conductivity, low-cost, and easy integration. However, the conductivity of these films suffers from the poor oxidation resistance of nanostructured copper during manufacturing, which becomes the problem of fabricating high electric conductivity nano-copper based flexible conductive films. Herein, the manufacturing routes for fabrication of these films including ink synthesis, printing, and sintering methods have been reviewed, especially highlighting the synthesis methods of the anti-oxidation inks. Features and applications of various advanced micro-nano joining processes for manufacturing flexible electronics have been discussed. Meanwhile, demonstrations of the conductive films in constructing flexible electronics are listed. Furthermore, remaining challenges and development trends for the fabrication of conductive films are concluded and prospected.