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Molecular dynamics simulation study of sintering mechanism and thermal conductivity of nano-Ag particles
WU Peng
,
WANG Yiping
,
YANG Dongsheng
,
FENG Jiayun
,
TIAN Yanhong
2023, 44(12): 1-7.
DOI:
10.12073/j.hjxb.20230613002
[Abstract]
[FullText HTML]
[PDF]
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Ultrafast laser microwelding and joint performance of silicon-sapphire heterogeneous structure for microfluidic device packaging
HU Yifan
,
LIN Luchan
,
LI Zhuguo
2023, 44(12): 8-14.
DOI:
10.12073/j.hjxb.20230613018
[Abstract]
[FullText HTML]
[PDF]
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)
Influence of the mesoscale porous structure features on the macroscale mechanical properties of sintered silver nanoparticles
LONG Xu
,
CHONG Kainan
,
SU Yutai
2023, 44(12): 15-20, 27.
DOI:
10.12073/j.hjxb.20230613005
[Abstract]
[FullText HTML]
[PDF]
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)
Joining mechanism and element distribution in laser micro-welding of NiTi-Cu dissimilar alloys
KE Wenchao
,
ZHANG Kang
,
ZHOU Naixun
,
CHEN Wenchang
,
CHEN Long
,
PANG Bowen
,
ZENG Zhi
2023, 44(12): 21-27.
DOI:
10.12073/j.hjxb.20230613006
[Abstract]
[FullText HTML]
[PDF]
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)
Microstructural characteristics and properties of Cu@Ag NPs interconnect joints fabricated via ultrasound-assisted sintering
XIU Zijin
,
ZHANG Penghao
,
ZHANG Wenwu
,
WANG Xiuqi
,
JI Hongjun
2023, 44(12): 28-34.
DOI:
10.12073/j.hjxb.20230613013
[Abstract]
[FullText HTML]
[PDF]
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)
Interface microstructure and properties of nickel/copper foil reflow soldering and laser soldering
SUN Qian
,
WANG Jiale
,
ZHOU Xingwen
,
WANG Xiaonan
2023, 44(12): 35-40.
DOI:
10.12073/j.hjxb.20230613016
[Abstract]
[FullText HTML]
[PDF]
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)
Microstructural and properties of ultrafast laser selective micro-welding joints of sapphire and Invar alloys
JIANG Qing
,
XU Jiayi
,
YANG Jin
,
ZHAO Yixuan
,
PAN Rui
,
LI Peng
2023, 44(12): 41-48, 62.
DOI:
10.12073/j.hjxb.20230613012
[Abstract]
[FullText HTML]
[PDF]
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)
Application and reliability of Au-Sn electroplated layer on the CSP hermetical packaging
LI Yafei
,
WANG Yuxiang
,
JI Xiaoliang
,
WEN Zhiru
,
MI Jia
,
WANG Hongbing
,
GUO Fu
2023, 44(12): 49-55.
DOI:
10.12073/j.hjxb.20230613003
[Abstract]
[FullText HTML]
[PDF]
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)
Impact of copper-plated carbon nanotubes on microstructure and properties of copper-based composite films
ZHAO Xinyu
,
LIU Qiang
,
CHENG Guowen
,
LIN Tiesong
,
HUANG Yongde
2023, 44(12): 56-62.
DOI:
10.12073/j.hjxb.20230613014
[Abstract]
[FullText HTML]
[PDF]
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)
High-temperature anti-electrochemical migration behavior of Ag-In composite paste
ZHANG Bowen
,
WANG Wei
,
FENG Haonan
,
ZHAO Zhiyuan
,
LU Xinyan
,
MEI Yunhui
2023, 44(12): 63-69.
DOI:
10.12073/j.hjxb.20230613009
[Abstract]
[FullText HTML]
[PDF]
(
)
Size effect behavior of microstructure and mechanical properties in Sn-58Bi micro solder joints
WANG Xiaowei
,
WANG Fengjiang
2023, 44(12): 70-74, 81.
DOI:
10.12073/j.hjxb.20230613008
[Abstract]
[FullText HTML]
[PDF]
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)
Thermal conductivity of flexible Cu-Ag composite thin films by laser direct writing
YAO Yu
,
GUO Wei
,
LIU Tong
,
ZHOU Xingwen
2023, 44(12): 75-81.
DOI:
10.12073/j.hjxb.20230613011
[Abstract]
[FullText HTML]
[PDF]
(
)
Research progress in low temperature bonding and patterning of metal nanomaterials
DU Rongbao
,
ZOU Guisheng
,
WANG Shuaiqi
,
LIU Lei
2023, 44(12): 82-96.
DOI:
10.12073/j.hjxb.20230613017
[Abstract]
[FullText HTML]
[PDF]
(
)
Research progress on ultrafast laser processing of two-dimensional materials
GUO Linglan
,
ZHANG Honghao
,
ZHANG Xinquan
,
ZHU Limin
,
SHEN Daozhi
2023, 44(12): 97-105.
DOI:
10.12073/j.hjxb.20230613007
[Abstract]
[FullText HTML]
[PDF]
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)
Research progress of laser direct writing technologies for the conductive metallic wire on dielectric surface
CUI Mengya
,
HUANG Ting
,
XIAO Rongshi
2023, 44(12): 106-115.
DOI:
10.12073/j.hjxb.20230613004
[Abstract]
[FullText HTML]
[PDF]
(
)
Research progress on low-temperature sintered silver and gold-based surface interconnections
WANG Zhiwei
,
LIN Liting
,
LI Xin
2023, 44(12): 116-123.
DOI:
10.12073/j.hjxb.20230613010
[Abstract]
[FullText HTML]
[PDF]
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)
Research progress in high-performance power device packaging and power cycle reliability
GUAN Ruofei
,
JIA Qiang
,
ZHAO Jin
,
ZHANG Hongqiang
,
WANG Yishu
,
ZOU Guisheng
,
GUO Fu
2023, 44(12): 124-136.
DOI:
10.12073/j.hjxb.20230613015
[Abstract]
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