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Molecular dynamics simulation study of sintering mechanism and thermal conductivity of nano-Ag particles
WU Peng, WANG Yiping, YANG Dongsheng, FENG Jiayun, TIAN Yanhong
2023, 44(12): 1-7. DOI: 10.12073/j.hjxb.20230613002
[Abstract] [PDF]
Ultrafast laser microwelding and joint performance of silicon-sapphire heterogeneous structure for microfluidic device packaging
HU Yifan, LIN Luchan, LI Zhuguo
2023, 44(12): 8-14. DOI: 10.12073/j.hjxb.20230613018
[Abstract] [PDF]
Influence of the mesoscale porous structure features on the macroscale mechanical properties of sintered silver nanoparticles
LONG Xu, CHONG Kainan, SU Yutai
2023, 44(12): 15-20, 27. DOI: 10.12073/j.hjxb.20230613005
[Abstract] [PDF]
Joining mechanism and element distribution in laser micro-welding of NiTi-Cu dissimilar alloys
KE Wenchao, ZHANG Kang, ZHOU Naixun, CHEN Wenchang, CHEN Long, PANG Bowen, ZENG Zhi
2023, 44(12): 21-27. DOI: 10.12073/j.hjxb.20230613006
[Abstract] [PDF]
Microstructural characteristics and properties of Cu@Ag NPs interconnect joints fabricated via ultrasound-assisted sintering
XIU Zijin, ZHANG Penghao, ZHANG Wenwu, WANG Xiuqi, JI Hongjun
2023, 44(12): 28-34. DOI: 10.12073/j.hjxb.20230613013
[Abstract] [PDF]
Interface microstructure and properties of nickel/copper foil reflow soldering and laser soldering
SUN Qian, WANG Jiale, ZHOU Xingwen, WANG Xiaonan
2023, 44(12): 35-40. DOI: 10.12073/j.hjxb.20230613016
[Abstract] [PDF]
Microstructural and properties of ultrafast laser selective micro-welding joints of sapphire and Invar alloys
JIANG Qing, XU Jiayi, YANG Jin, ZHAO Yixuan, PAN Rui, LI Peng
2023, 44(12): 41-48, 62. DOI: 10.12073/j.hjxb.20230613012
[Abstract] [PDF]
Application and reliability of Au-Sn electroplated layer on the CSP hermetical packaging
LI Yafei, WANG Yuxiang, JI Xiaoliang, WEN Zhiru, MI Jia, WANG Hongbing, GUO Fu
2023, 44(12): 49-55. DOI: 10.12073/j.hjxb.20230613003
[Abstract] [PDF]
Impact of copper-plated carbon nanotubes on microstructure and properties of copper-based composite films
ZHAO Xinyu, LIU Qiang, CHENG Guowen, LIN Tiesong, HUANG Yongde
2023, 44(12): 56-62. DOI: 10.12073/j.hjxb.20230613014
[Abstract] [PDF]
High-temperature anti-electrochemical migration behavior of Ag-In composite paste
ZHANG Bowen, WANG Wei, FENG Haonan, ZHAO Zhiyuan, LU Xinyan, MEI Yunhui
2023, 44(12): 63-69. DOI: 10.12073/j.hjxb.20230613009
[Abstract] [PDF]
Size effect behavior of microstructure and mechanical properties in Sn-58Bi micro solder joints
WANG Xiaowei, WANG Fengjiang
2023, 44(12): 70-74, 81. DOI: 10.12073/j.hjxb.20230613008
[Abstract] [PDF]
Thermal conductivity of flexible Cu-Ag composite thin films by laser direct writing
YAO Yu, GUO Wei, LIU Tong, ZHOU Xingwen
2023, 44(12): 75-81. DOI: 10.12073/j.hjxb.20230613011
[Abstract] [PDF]
Research progress in low temperature bonding and patterning of metal nanomaterials
DU Rongbao, ZOU Guisheng, WANG Shuaiqi, LIU Lei
2023, 44(12): 82-96. DOI: 10.12073/j.hjxb.20230613017
[Abstract] [PDF]
Research progress on ultrafast laser processing of two-dimensional materials
GUO Linglan, ZHANG Honghao, ZHANG Xinquan, ZHU Limin, SHEN Daozhi
2023, 44(12): 97-105. DOI: 10.12073/j.hjxb.20230613007
[Abstract] [PDF]
Research progress of laser direct writing technologies for the conductive metallic wire on dielectric surface
CUI Mengya, HUANG Ting, XIAO Rongshi
2023, 44(12): 106-115. DOI: 10.12073/j.hjxb.20230613004
[Abstract] [PDF]
Research progress on low-temperature sintered silver and gold-based surface interconnections
WANG Zhiwei, LIN Liting, LI Xin
2023, 44(12): 116-123. DOI: 10.12073/j.hjxb.20230613010
[Abstract] [PDF]
Research progress in high-performance power device packaging and power cycle reliability
GUAN Ruofei, JIA Qiang, ZHAO Jin, ZHANG Hongqiang, WANG Yishu, ZOU Guisheng, GUO Fu
2023, 44(12): 124-136. DOI: 10.12073/j.hjxb.20230613015
[Abstract] [PDF]