Interface microstructure and properties of nickel/copper foil reflow soldering and laser soldering

SUN Qian; WANG Jiale; ZHOU Xingwen; WANG Xiaonan

doi:10.12073/j.hjxb.20230613016

TRANSACTIONS OF THE CHINA WELDING INSTITUTION > 2023 > 44(12): 35-40. > DOI: 10.12073/j.hjxb.20230613016

SUN Qian, WANG Jiale, ZHOU Xingwen, WANG Xiaonan. Interface microstructure and properties of nickel/copper foil reflow soldering and laser soldering[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(12): 35-40. DOI: 10.12073/j.hjxb.20230613016

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Interface microstructure and properties of nickel/copper foil reflow soldering and laser soldering

Soochow University, Suzhou, 215131, China

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Received Date: June 12, 2023
Available Online: November 17, 2023

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Abstract

Abstract

Under the background of replacing aluminum copper direct welding with nickel foil "bridge", heterogeneous connection of nickel copper foil is carried out using reflow soldering and semiconductor laser soldering. A comparative analysis was conducted on the formation mechanism of joint morphology, weld seam and interface microstructure, and their mechanical properties were evaluated. The research results showed that the weld defects were not detected for two welded joints. The microstructure of laser soldering welds was composed of Sn solid solution and Cu-Sn intermetallic compounds (IMCs) with equiaxed crystal morphology, while microstructure of reflow soldering welds was composed of Sn solid solution. The Cu-Sn and Ni-Sn interfaces of the two joints showed different morphologies, and the thickness of the Cu-Sn interface layer was greater than that of Ni-Sn interface. The microstructure at the Cu-Sn interface during reflow soldering was scallop-shaped, consisting of Cu solid solution →Cu₃Sn IMCs→ Cu₆Sn₅ IMCs. For laser soldering joints, the Cu-Sn interface consisted of various Cu-Sn IMCs. At the Ni-Sn interface, a continuous distribution of (Cu, Ni)₆Sn₅ IMCs was presented in the reflow soldering welds, while the short rod-shaped (Cu, Ni)₃Sn₄ and strip shaped (Cu, Ni)₆Sn₅ was showed in the laser soldering welds. The maximum shear force values of the two joints can reach over 320 N, far higher than actual production requirements. Based on this research results, it further demonstrated that laser soldering is a feasible technology to replace reflow soldering for the nickel/copper foil connection.
- reflow soldering,
- laser soldering,
- Sn solder,
- intermetallic compounds

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References (26)

References

[1]	吴博尧, 秦磊, 张庆茂, 等. 基于视觉的动力电池焊后质量检测[J]. 焊接学报, 2018, 39(9): 122 − 128. Wu Boyao, Qin Lei, Zhang Qingmao, et al. Research on vision-based post-welding quality inspection of power battery[J]. Transactions of the China Welding Institution, 2018, 39(9): 122 − 128.
[2]	Kumar N, Masters I, Das A. In-depth evaluation of laser-welded similar and dissimilar material tab-to-busbar electrical interconnects for electric vehicle battery pack[J]. Journal of Manufacturing Processes, 2021, 70: 78 − 96. doi: 10.1016/j.jmapro.2021.08.025
[3]	Yang P, Tarascon J M. Towards systems materials engineering[J]. Nature Materials, 2012, 11: 560 − 563. doi: 10.1038/nmat3367
[4]	Lerra F, Ascari A, Fortunato A. The influence of laser pulse shape and separation distance on dissimilar welding of Al and Cu films[J]. Journal of Manufacturing Processes, 2019, 45: 331 − 339. doi: 10.1016/j.jmapro.2019.07.015
[5]	李东, 赵杨洋, 张延松. 焊接能量对铝/铜超声波焊接接头显微组织的影响[J]. 焊接学报, 2014, 35(2): 47-50. Li Dong, Zhao Yangyang, Zhang Yansong. Effect of welding energy on microstructures of the Al/Cu joints obtained by ultrasonic welding[J]. Transactions of the China Welding Institution, 2014, 35(2): 47-50.
[6]	邓呈敏, 程东海, 张华, 等. 焊丝成分对铝/铜激光熔钎焊接头组织和性能的影响[J]. 焊接学报, 2022, 43(1): 16 − 21. Deng Chengmin, Cheng Donghai, Zhang Hua, et al. Effect of welding wire composition on microstucture and properties on Al/Cu laser welding-brazing joints[J]. Transactions of the China Welding Institution, 2022, 43(1): 16 − 21.
[7]	吴小伟, 沈以赴, 李博, 等. 铝—铜搅拌摩擦焊搭接焊缝共晶组织形成与抑制[J]. 焊接学报, 2014, 35(1): 87 − 90. Wu Xiaowei, Shen Yifu, Li Bo, et al. Formation and inhibition of eutectics in Al/Cu dissimilar metal lap joint[J]. Transactions of the China Welding Institution, 2014, 35(1): 87 − 90.
[8]	Yang J W, Cao B, He X C, et al. Microstructure evolution and mechanical properties of Cu–Al joints by ultrasonic welding[J]. Science and Technology of Welding and Joining, 2015, 19(6): 500 − 504.
[9]	Chu K, Sohn Y, Moon C. A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding[J]. Scripta Materialia, 2015, 109: 113 − 117. doi: 10.1016/j.scriptamat.2015.07.032
[10]	Wang S J, Liu C Y. Study of interaction between Cu-Sn and Ni-Sn interfacial reactions by Ni-Sn3.5Ag-Cu sandwich structure[J]. Journal of Electronic Materials, 2003, 32(11): 1303 − 1309. doi: 10.1007/s11664-003-0027-0
[11]	Zhong Y, Zhao N, Dong W, et al. Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding[J]. Journal of materials research, 2017, 32(16): 3128 − 3136. doi: 10.1557/jmr.2017.171
[12]	Huan P C, Tang X X, Sun Q, et al. Comparative study of solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum laser soldering joint[J]. Materials & Design, 2022, 215: 11048.
[13]	Kordás K, Pap A E, Tóth G, et al. Laser soldering of flip-chips[J]. Optics and Lasers in Engineering, 2006, 44(2): 112 − 121. doi: 10.1016/j.optlaseng.2005.03.002
[14]	Yang Z, Li L, Chen W, et al. Numerical and experimental study on laser soldering process of SnAgCu lead-free solder[J]. Materials Chemistry and Physics, 2021, 273: 125046. doi: 10.1016/j.matchemphys.2021.125046
[15]	Kunwar A, An L L, Liu J H, et al. A data-driven framework to predict the morphology of interfacial Cu₆Sn₅ IMC in SAC/Cu system during laser soldering[J]. Journal of Materials Science & Technology, 2020, 50: 115 − 127.
[16]	Joo H S, Lee C J, Min K D, et al. Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding[J]. Journal of Materials Science:Materials in Electronics, 2020, 31(24): 22926 − 22932. doi: 10.1007/s10854-020-04819-0
[17]	Nishikawa H, Iwata N, Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu pad[J]. Journal of Materials Processing Technology, 2015, 215: 6-11.
[18]	Lee T Y, Choi W J, Tu K N, et al. Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu[J]. Journal of Materials Research, 2002, 17(2): 291 − 301. doi: 10.1557/JMR.2002.0042
[19]	Lai Y, Chen S, Ren X, et al. Solid-liquid interdiffusion bonding of Cu/Sn/Ni Micro-joints with the assistance of temperature gradient[J]. Acta Metallurgica Sinica, 2022, 35(11): 1912 − 1924.
[20]	Chen L D, Huang M L, Zhou S M. Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect[J]. Journal of Alloys and Compounds, 2010, 504(2): 535 − 541. doi: 10.1016/j.jallcom.2010.05.158
[21]	Chung C K, Duh J G, Kao C R. Direct evidence for a Cu-enriched region at the boundary between Cu₆Sn₅ and Cu₃Sn during Cu/Sn reaction[J]. Scripta Materialia, 2010, 63(2): 258-260.
[22]	Mo L P, Guo C W, Zhou Z, et al. Microstructural evolution of Cu-Sn-Ni compounds in full intermetallic micro-joint and in situ micro-bending test[J]. Journal of Materials Science-Materials in Electronics, 2018, 29(14): 11920 − 11929. doi: 10.1007/s10854-018-9293-8
[23]	Görlich J, Schmitz G, Tu K N. On the mechanism of the binary Cu/Sn solder reaction[J]. Applied Physics Letters, 2005, 86: 053106
[24]	Zhang Z, Hu X W, Jiang X X, et al. Influences of mono-Ni (P) and dual-Cu/Ni (P) plating on the interfacial microstructure evolution of solder joints[J]. Metallurgical and Materials Transactions A, 2018, 50(1): 480 − 492.
[25]	Pal M K, Gergely G, Koncz-Horváth D, et al. Investigation of microstructure and wetting behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with additions of 1.0 wt % SiC on copper substrate[J]. Intermetallics, 2021, 128: 106991. doi: 10.1016/j.intermet.2020.106991
[26]	Zhang L, Gao L L. Interfacial compounds growth of SnAgCu(nano La2O3)/Cu solder joints based on experiments and FEM[J]. Journal of Alloys and Compounds, 2015, 635: 55-60.

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[4]	WANG Jianhua, MENG Gongge, SUN Fenglian. Study on growth rate of interfacial metallic compound in SAC305/Cu joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(5): 47-50,76.
[5]	LIU Ruirui, ZHAO Zhilong, AI Changhui, LI Jingwei, LIU Lin. Microstructure of fusion zone deposited intermetallics CrFeNb on Nickel-base superalloy K4169[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(2): 71-74.
[6]	QIN Fei, AN Tong, ZHONG Weixu, LIU Chengyan. Nanoindentation properties of intermetallic compounds in lead-free solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (1): 25-28,32.
[7]	QI Kai, WANG Fengjiang, LAI Zhongmin. Inhibition growth of intermetallic compounds at solder/Cu of by addition of Zn into Sn-3.5Ag[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (10): 57-60.
[8]	ZHU Dongmei, WANG Xibao. Mcrostrueture of Fe₃A₁ intermetallic compound produced by plasma cladding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (12): 17-19,24.
[9]	HE Peng, FENG Ji-cai, QIAN Yi-yu, ZHANG Jiu-hai. Forming Mechanism of interface intermetallic Compounds for Difusion Bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2001, (1): 53-55.
[10]	HE Peng, ZHANG Jiu-hai, FENG Ji-cai, QIAN Yi-yu. Numeric Simulation for Interface Intermetallic Compounds of Phase Transformation Diffusion Bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2000, (3): 75-78.

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Interface microstructure and properties of nickel/copper foil reflow soldering and laser soldering