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| Citation: |
GUAN Ruofei, JIA Qiang, ZHAO Jin, ZHANG Hongqiang, WANG Yishu, ZOU Guisheng, GUO Fu. Research progress in high-performance power device packaging and power cycle reliability[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(12): 124-136. DOI: 10.12073/j.hjxb.20230613015
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The progress of semiconductor technology has made power devices face higher voltage, power density and junction temperature, which puts forward higher requirements for the reliability of power device packaging. How to improve and detect the reliability of power devices has become an important task in the development of power devices. Improving packaging reliability mainly focuses on optimizing packaging structure, improving die attach technology and wire bonding technology. Power cycling, as a reliability testing method closest to the actual operating conditions of power devices, has been widely studied in terms of testing techniques, monitoring methods, and failure mechanisms. This paper provides a review of research on the packaging structure, packaging technology, power cycling mechanism of power devices and attempts to summarize the methods for improving packaging reliability at home and abroad in recent years. This review also discusses the principles of power cycling test and the failure mechanisms of solder layers and bonding wires . Finally, the future development trend of power device packaging was prospected.
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