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HE Peng, JIAO Zhen, WANG Jun, LIN Tiesong. Research and application of joining technology at nanometer scale[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (2): 109-112.
Citation: HE Peng, JIAO Zhen, WANG Jun, LIN Tiesong. Research and application of joining technology at nanometer scale[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (2): 109-112.
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Research and application of joining technology at nanometer scale

  • State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

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  • Received Date: January 03, 2012
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    • Abstract
  • Nanomaterials have been widely applied due to their unique properties. Joining technology at nanometer scale is gradually developed with the popularity of nanomaterials,which has broad application prospects in the fields of electronics,aerospace, biology,and health care. The microscopic effects of nanomaterials were introduced and the current development of joining technology at nanometer scale were reviewed. Solid state bonding,soldering/brazing and fusion welding were mainly discussed. The differences in some phenomena and physical processes between nanoscale and macroscale were analyzed. In addition, the function of molecular dynamics simulation in nano-joining field was pointed out. At last,the application prospect of joining technology at nanometer scale was presented.
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