Microstructure and strength of SiC/Nb joint with Cu based brazing filler metal
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Graphical Abstract
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Abstract
SiC ceramic was bonded to Nb alloy using Cu basedbrazing filler metal at temperatures,from 1 045℃ to 1 101℃ for 300 s in vacuum.The microstructure and high temperature strength of the joint were investigated.The high temperature strength of the joint increased with the increasing of brazing temperature.The diffusion layer which con-sists of Cu and C solid solution could be observed by scanning electronmicroscope.The diffusion layer could relieve the stress which had beenproduced during cooling.The three point bending strength of the joint canget to 290MPa at 500℃.
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