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Effect of cerium on wettability and mechanical properties of soldered joints for Sn-Ag-Cu lead free solder
XUE Song-bai, CHEN Yan, LÜ Xiao-chun, LIAO Yong-ping
2005(10): 1-4.
[Abstract] [PDF]
Rich argon protecting welding CAPP system development
WANG Ke-hong, HAN Jie, LI Shuai, WANG Jia-jun
2005(10): 5-8.
[Abstract] [PDF]
Dynamic cracking behaviors of weld solidification cracks for aluminum alloys at elevated temperature
LIU Ren-pei, DONG Zu-jue, PAN Yong-ming
2005(10): 9-13.
[Abstract] [PDF]
Double close loops control system of peak current mode of inverter arc welding power supply
FANG Chen-fu, YIN Shu-yan, HOU Run-shi, YU Ming, WANG Jin-cheng
2005(10): 14-18.
[Abstract] [PDF]
Visual inspection of heated area on Cr plating layer surface by plasma beam
WANG Ke-hong, ZHU Ping, ZHANG De-ku, ZHU Wu-ying, GU Ming-le
2005(10): 19-22.
[Abstract] [PDF]
Effects of rare-earth element Ce on physical properties and mechanical properties of Sn-Ag-Cu lead-free solder
XUE Song-bai, LIU Lin, DAI Yong-feng, YAO Li-hua
2005(10): 23-26.
[Abstract] [PDF]
Measurement and analysis of the eutectic aluminum alloys of 6082 and Zl101
LIU Ren-pei, DONG Zu-jue, PAN Yong-ming
2005(10): 27-30.
[Abstract] [PDF]
Optimization of twin wire automatic welding process for dissimilar Al-alloy
XU Yue-lan, WANG Pin, LIU Yong,
2005(10): 31-34.
[Abstract] [PDF]
Weld workpiece model design system based on feature
LIU Yong, WANG Ke-hong, XU Yue-lan, YANG Jing-yu
2005(10): 35-38.
[Abstract] [PDF]
Brazing technology of aluminium alloy containing scandium
WANG Shao-gang, XIANG Ding-han, ZHENG Yong
2005(10): 39-42.
[Abstract] [PDF]
Thermodynamical analysis of active SiO2 in interfacial chemical reaction between slag and liquid metal based on thermal-dynamic coupling
LI Xiao-quan, YANG Xu-guang, FANG Chen-fu
2005(10): 43-46.
[Abstract] [PDF]
Effect of N2 on wettability of Sn-Ag-Cu solder on components/devices lead frame and lead-free coating
LIU Lin, XUE Song-bai, XU Wen-da, YAO Li-hua
2005(10): 47-50.
[Abstract] [PDF]
Research of Ti-Zr-Ni-Cu based amorphous brazing material
ZOU Jia-sheng, XU Zhi-rong, JIANG Zhi-guo, ZHAO Qi-zhang
2005(10): 51-53.
[Abstract] [PDF]
A-TIG Weld analysis of AZ31 Magnesium alloy
XU Jie, LIU Zi-li, SHEN Yi-fu, CHEN Wen-hua
2005(10): 54-58.
[Abstract] [PDF]
Si3N4 ceramics brazing with composite soldering materials
ZHANG De-ku, WU Ai-ping, ZOU Gui-sheng
2005(10): 59-61.
[Abstract] [PDF]
Study on shear strength of soldered joints of BGA packaging devices
XUE Song-bai, HU Yong-Fang, YU Sheng-lin
2005(10): 62-64.
[Abstract] [PDF]
A new rotating arc process for narrow gap MAG welding
WANG Jia-you, GUO Hong-bin, YANG Feng
2005(10): 65-67.
[Abstract] [PDF]
Liquid spreading and micro structure of Ti/Cu eutectic reaction
WU Ming-fang, YANG min, ZHANG Chao, MA Cheng, YANG Pei
2005(10): 68-71.
[Abstract] [PDF]
Effects of lead-free solder on the tensile strength of QFP micro-joints soldered with different pitchs
HU Yong-fang, XUE Song-bai, SHI Yi-ping, YU Sheng-lin
2005(10): 72-74.
[Abstract] [PDF]
Interface strengthening process of Cr plating layer by plasma beam
WANG Ke-hong, ZHANG Chun-yang, ZHU Ping, Gu Min-le, ZHU Wu-ying
2005(10): 75-77.
[Abstract] [PDF]
Study on strength of soldered micro-joints of QFP devices
HU Yong-fang, XUE Song-bai, YU Sheng-lin
2005(10): 78-80.
[Abstract] [PDF]
Reliability of CBGA soldered joint under thermal cycling
XUE Song-bai, HU Yong-fang, YU Sheng-lin
2005(10): 81-83.
[Abstract] [PDF]
Low cycle fatigue property of TA5 titanium alloy welded joint
YAN Keng, ZHANG Pei-lei, JIANG Cheng-yu
2005(10): 84-86.
[Abstract] [PDF]
Microstructures and properties of 7A52 aluminum alloy welded joint by twin wire welding
YU Jin, WANG Ke-hong, XU Yue-lan, LIU Yong
2005(10): 87-89.
[Abstract] [PDF]
Effect of diode-laser parameters on tensile strength of QFP micro-joints
YAO Li-hua, XUE Song-bai, WANG Peng, LIU Lin
2005(10): 90-92.
[Abstract] [PDF]
Effects of temperature and coatings on wettability of Sn-Ag-Cu lead-free solder
WANG Xu-yan, XUE Song-bai, YU Sheng-lin, ZHU Xiao-jun
2005(10): 93-96.
[Abstract] [PDF]
FEM analysis of stress and strain in CBGA solder joint with different size under thermal cycle
HU Yong-fang, XUE Song-bai, YU Sheng-lin
2005(10): 97-100.
[Abstract] [PDF]
Effect of process parameters and interlayer on properties of 1420 Al-Li alloy diffusion bonded joint
CHEN Wen-hua, QIN Zhan-yan, SHEN Yi-fu
2005(10): 101-104.
[Abstract] [PDF]
Effect of CPGA gull wing lead size on reliability of soldered joints
WU Yu-xiu, XUE Song-bai, HU Yong-fang
2005(10): 105-108.
[Abstract] [PDF]
Water cleaning technology for surface mounted components soldered with Sn-Ag-Cu solder
WANG Xu-yan, XUE Song-bai, WANG Hai-song, YU Sheng-lin
2005(10): 109-112.
[Abstract] [PDF]

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