Water cleaning technology for surface mounted components soldered with Sn-Ag-Cu solder

Simulative specimens and SMC soldered with layer resistances were cleaned by SMT450-LD SMT water-cleaning system and the results indicate that the layer resistance mounted on FR4 by Sn-Ag-Cu no-cleaning solder paste is clean and the residua concentrateion on PCB surface is about 1.9μg/cm²,which met the requirement of MIL-STD-2000(the residua concentrateion on PCB surface should be less than 5.7μg/cm²).Cleaning parameters such as cleaning temperature and cleaning time have great effects on the cleaning result.