FEM analysis of stress and strain in CBGA solder joint with different size under thermal cycle

The components of CBGA was simplified into 2-D model of finite element analysis for the stress and strain of soldered joint,and the finite element method was used to simulate the distribution of stress and strain of three kinds of CBGA components(0.76 mm,1.0 mm and 1.3 mm) under thermal cycle,and calculate the maximum of stress and strain.The results show that the reliability of CBGA components with(0.76 mm) diameter is the best and the analysis indicates the finite element simulation is suitable for studying reliability of all kinds of soldered joints in packaging of microelectronics.