XUE Song-bai, HU Yong-Fang, YU Sheng-lin. Study on shear strength of soldered joints of BGA packaging devices[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (10): 62-64.
Citation:
XUE Song-bai, HU Yong-Fang, YU Sheng-lin. Study on shear strength of soldered joints of BGA packaging devices[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (10): 62-64.
XUE Song-bai, HU Yong-Fang, YU Sheng-lin. Study on shear strength of soldered joints of BGA packaging devices[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (10): 62-64.
Citation:
XUE Song-bai, HU Yong-Fang, YU Sheng-lin. Study on shear strength of soldered joints of BGA packaging devices[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (10): 62-64.
Study on shear strength of soldered joints of BGA packaging devices
Shear strength of BGA packaging device joints with Sn-Pb eutectic solder were studied in the paper using Micro-joints Strength Tester,and compared BGA joints shear strength with different diameters.The results indicate that in the same conditions,the bigger BGA diameter is,the smaller the shear strength is.The shear strength of BGA joint with eutectic solder is higher than that of tin-lead alloy itself.
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