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LIANG Ying, HUANG Chunyue, ZHANG Xin, HUANG Wei, LI Tianming. Study on stress and strain of adhesive fillet of MOEMS package under temperature cycle[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(1): 6-10.
Citation: LIANG Ying, HUANG Chunyue, ZHANG Xin, HUANG Wei, LI Tianming. Study on stress and strain of adhesive fillet of MOEMS package under temperature cycle[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(1): 6-10.
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Study on stress and strain of adhesive fillet of MOEMS package under temperature cycle

  • 1.

    Department of Electronic Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu 610021, China

  • 2.

    School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin 541004, China

  • 3.

    Department of Automobile and Power Engineering, Guilin University of Aerospace Technology, Guilin 541004, China

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  • Received Date: April 26, 2014
    Graphical Abstract
    • Abstract
  • The stress and strain distribution on adhesive fillet of micro optical electro mechanical systems(MOEMS) package were analyzed under temperature cycle by using finite element analysis (FEA). The adhesive fillet thickness, fillet height and width were selected as three key configuration parameters, and an orthogonal design consisting of the 25 different combinations were conducted. The maximum stress and strain within the adhesive fillet were obtained. The variance analyses of stress and strain were performed. The results show that with 95% confidence, the adhesive fillet thickness and adhesive width have significant effect on the stress, the adhesive fillet thickness has significant effect on the strain. The adhesive fillet thickness, the adhesive width and the adhesive fillet height affect the stress and strain in a descending order. When the other parameters is unchanged, the maximum stress and strain descend with the increasing of the adhesive fillet thickness and the adhesive width under temperature load.
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    • References (8)
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