Study on stress and strain of adhesive fillet of MOEMS package under temperature cycle

The stress and strain distribution on adhesive fillet of micro optical electro mechanical systems(MOEMS) package were analyzed under temperature cycle by using finite element analysis (FEA). The adhesive fillet thickness, fillet height and width were selected as three key configuration parameters, and an orthogonal design consisting of the 25 different combinations were conducted. The maximum stress and strain within the adhesive fillet were obtained. The variance analyses of stress and strain were performed. The results show that with 95% confidence, the adhesive fillet thickness and adhesive width have significant effect on the stress, the adhesive fillet thickness has significant effect on the strain. The adhesive fillet thickness, the adhesive width and the adhesive fillet height affect the stress and strain in a descending order. When the other parameters is unchanged, the maximum stress and strain descend with the increasing of the adhesive fillet thickness and the adhesive width under temperature load.