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CAO Jian, SONG Xiaoguo, WANG Yifeng, FENG Jicai. Interfacial microstructure and properties of Si3N4/Ni/TiAl joint boned by diffusion-bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (6): 1-4.
Citation: CAO Jian, SONG Xiaoguo, WANG Yifeng, FENG Jicai. Interfacial microstructure and properties of Si3N4/Ni/TiAl joint boned by diffusion-bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (6): 1-4.
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Interfacial microstructure and properties of Si3N4/Ni/TiAl joint boned by diffusion-bonding

  • 1.

    Harbin Institute of Technology, State Key Laboratory of Advanced Welding Production Technology, Harbin 150001, China

  • 2.

    Harbin Institute of Technology, State Key Laboratory of Advanced Welding Production Technology, Harbin 150001, China;Heilongjiang Institute of Technology, Harbin 150050, China

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  • Received Date: December 13, 2010
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    • Abstract
  • Diffusion bonding of Si3N4 ceramic and TiAl alloy was achieved using 80μm thick Ni foil as interlayer.The interfacial microstructure was TiAl/Al5Ni2Ti3/AlNi2Ti/Ni3(Ti,Al)/Ni(s,s)+Ni3Si/Si3N4,which was analyzed by SEM,EDS and XRD.The effect of bonding temperature on interfacial microstructure and joining properties of the Si3N4/Ni/TiAl joints were investigated in details.With an increase of temperature,the inter-diffusion rate of alloying elements at the TiAl/Ni and Ni/Si3N4 interfaces increased gradually,which led to an increase in thickness of reaction layers.A porous zone formed between Ni and Si3N4 when the temperature was relatively high,where cracks performed to come forth.The highest shear strength of 104.2 MPa was obtained when the specimen was bonded at 1 000℃ for 2 h.Fracture analysis indicated that cracks initiated at the Si3N4/Ni interface and propagated to Si3N4 substrate finally ruptured within ceramic.
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