Finite element modeling of residual stress in bonding interface of Ni-Cr/porcelain

The numerical value and distribution of residual stress in the bonding interface of Ni-Cr/porcelain and Ni-Cr/Ti/porcelain have been investigated by finite element method.The experimental results show that there is much difference in thermal expansion coefficient between Ni-Cr alloy and proclaim.Larger residual stress will be produced at the interface.Due to produced stress concentration at the corner resulted in edge effect,the maximal value of residual stress is 131 MPa,which appears at the Ni-Cr alloy/proclaim interface near proclaim side.The greater σ_z value appears in a narrow area on the near porcelain side.The greater shearing stress τ_zx value appears in the Ni-Cr/porcelain interface,and gradually decreases to Ni-Cr alloy and porcelain sides.Residual stress and distribution position of Ni-Cr/Ti/porcelain has been improved when using Ti interlayer comparing with the residual stress of Ni-Cr/porcelain interface.Inner stress between Ni-Cr alloy and porcelain has been released and the residual stress is transferred to Ti interlayer;The thickness of Ti interlayer has effects on residual stress,the σ_z of interface is increasing and shearing stress τ_zx is little different with the interlayer thickness increasing.