Advanced Search
CHEN Zheng, K.Ikeuchi, M.Takahashi, S.Nishikawa. Electric Field-assisted Anodic Bonding of Glass to Kovar Alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2001, (4): 21-25.
Citation: CHEN Zheng, K.Ikeuchi, M.Takahashi, S.Nishikawa. Electric Field-assisted Anodic Bonding of Glass to Kovar Alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2001, (4): 21-25.

Electric Field-assisted Anodic Bonding of Glass to Kovar Alloy

More Information
  • Received Date: November 13, 2000
  • Electric field-assisted anodic bonding of glass to Kovar alloy was preformed at temperature 613 K under applied voltage 500 V.The interfaces were investigated by SEM observation and EPMA analyses.In order to determine the joint strength,shear tests were carried out.The results show that intimately contacted area between Kovar alloy and the glass enlarges from initial contact area with increase of bonding time.Na and K ions involved in the glass move toward the cathode from the anode surface under the electric field,resulting in depleted layers of the adjacent anode surface.The thickness of depleted layers increases with increasing bonding time.The stable joint strength of about 8~12 MPa can be achieved as long as ≈100% intimately contacted area between Kovar alloy and the glass is obtained.These results are discussed by considering the inference of the applied electric field.
  • Related Articles

    [1]LI Wenwen<sup>1</sup>, XIONG Huaping<sup>1</sup>, CHEN Bo<sup>1</sup>, ZOU Wenjiang<sup>1</sup>, LIU Wei<sup>2</sup>. Microstructure and mechanical property of Cf/SiBCN composite joint brazed with Cu-Pd-V filler alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(9): 90-94. DOI: 10.12073/j.hjxb.2018390230
    [2]WU Mingfang, KUANG Hongjin, WANG Fei, XU Guoxiang. Interfacial behavior and joint strength of Ti (C,N) and 40Cr joints obtained by liquid-solid diffusion hybrid bonding method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2014, 35(5): 5-8.
    [3]YANG Weihua, LI Jinglong, XIONG Jiangtao, ZHANG Fusheng, L&#220; Xuechao. Morphological analysis of interfacial reaction layers in Mo foil and Al foil jointing by diffusion bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (12): 41-45.
    [4]HE Peng, YANG Xiujuan, FENG Jicai, LIU Hong. Effects of holding time on interface structure and bonding strength of brazed joint of hydrogenated TC4 titanium alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (2): 1-4.
    [5]FENG Ji-cai, JING Xiang-meng, ZHANG Li-xia, LIU Hong. Interface structure and bonding strength of brazed joint of TiC cermet/steel[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2006, (1): 5-8.
    [6]LONG Zhi-li, HAN lei, WU Yun-xin, ZHOU Hong-quan. Effect of different temperature on strength of thermosonic bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (8): 23-26,38.
    [7]ZOU Jia-sheng, XU Zhi-rong, ZHAO Qi-zhang, CHEN Zheng. Bonding strength of double partial transient liquid phase bonding with Si3N4/Ti/Cu/Ni/Cu/Ti/Si3N4[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (2): 41-44.
    [8]LIU Jun-hong, SUN Kang-ning, GONG Hong-yu, TAN Xun-yan. Interfacial microstructure of Al2O3-based ceramic composite/steel joint by brazing in air[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2003, (6): 26-28.
    [9]ZOU Jia-sheng, ZHAI Jian-guang, CHU Ya-jie, CHEN Zheng. Effect of Ti foil thickness on interfacial structure and strength in PTLP bonding of Si3N4/Ti/Cu/Ti/Si3N4[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2003, (6): 19-22.
    [10]CHEN Zheng, GU Xiao-bo, LI Guo-an, FANG Fang. Diffusion Bonding of Si3N4 Ceramic to Ni with Non-active Metal Interlayers of FeNi/Cu[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2001, (3): 25-28.

Catalog

    Article views (221) PDF downloads (60) Cited by()

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return