Effect of Ti foil thickness on interfacial structure and strength in PTLP bonding of Si₃N₄/Ti/Cu/Ti/Si₃N₄

Partial transient liquid-phase bonding (PTLP bonding) of Si₃N₄ ceramic with Ti/Cu/Ti multi-interlayer was performed by changing the thickness of Ti foil.The effect of Ti foil thickness on interface structure and joint strength was discussed.The joint interfaces were analyzed by SEM and EPMA.The results show that under the experimental conditions high joint strengthen 210 MPa is obtained at room temperature.When bonding temperature and time was not changed and the process of isothermal solidification was carried completely,interface structure,reaction layer thickness and isothermal solidification thickness were changed with the change of Ti foil thickness.