Bonding strength of double partial transient liquid phase bonding with Si₃N₄/Ti/Cu/Ni/Cu/Ti/Si₃N₄

The influence of bonding parameters and testing temperature on bonding strength was studied under double partial transient liquid phase(PTLP) bonding with Si₃N₄ ceramic using Ti/Cu/Ni inter-layer.The results showed that the bonding strength at room temperature increases with second bonding temperature and second holding time,and bonding parameters have slight influence on thickness of reaction layer in Si₃N₄/Ti/Cu/Ni interface of double PTLP bonding.The bonding strength was the highest at testing temperature 400℃,and the bonding strength declined when the temperature continued to increase.But the high temperature strength had good stability if the temperature was less than 800℃.