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LIU Xudong, SA Zicheng, FENG Jiayun, LI Haozhe, TIAN Yanhong. The Development Status On Advanced Packaging Copper Pillar Bump Interconnection Technology and Reliability[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION. DOI: 10.12073/j.hjxb.20240718001
Citation: LIU Xudong, SA Zicheng, FENG Jiayun, LI Haozhe, TIAN Yanhong. The Development Status On Advanced Packaging Copper Pillar Bump Interconnection Technology and Reliability[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION. DOI: 10.12073/j.hjxb.20240718001
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The Development Status On Advanced Packaging Copper Pillar Bump Interconnection Technology and Reliability

  • State Key Laboratory of Precision Welding & Joining of Materials and Structures, Harbin, 150001, China

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  • Received Date: July 17, 2024
  • Available Online: December 26, 2024
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    • Abstract

  • With the rapid development of the lightweight electronic components, copper pillar bump (CPB) provides a high-performance, high-reliability flip-chip interconnect solution with its unique structure, smaller size and higher connection density. In this paper, the differences between conventional C4 bumps and CPB are compared, and the advantages of CPB in terms of structure and performance are summarized, while the challenges faced by CPB are presented. The process flow of the electroplating method is discussed, and the effects of the plating solution composition and plating parameters on the quality of CPB are reviewed. This paper summarizes the performance of CPB in terms of thermal-cycle and electromigration reliability, including the effects of thermal aging, thermal cycling, and electromigration tests on CPB. Finally, the future development direction of CPB is summarized and prospected.

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