Advanced Search
WANG Haichao, PENG Xiaowei, GUO Fan, DING Yingjie, CHEN Qiang. Research on reliability of CCGA reinforcement process for aerospace electronic products[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(7): 102-107. DOI: 10.12073/j.hjxb.20210907001
Citation: WANG Haichao, PENG Xiaowei, GUO Fan, DING Yingjie, CHEN Qiang. Research on reliability of CCGA reinforcement process for aerospace electronic products[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(7): 102-107. DOI: 10.12073/j.hjxb.20210907001

Research on reliability of CCGA reinforcement process for aerospace electronic products

More Information
  • Received Date: September 06, 2021
  • Available Online: April 28, 2022
  • Ceramic column grid array packaging device (CCGA) are widely used in aerospace electronic products. The assembly and welding quality of CCGA is closely related to the device size and reinforcement process. This paper studied the effects of primted circurt board (PCB) constraints and CCGA reinforcement process on solder joint reliability by experiment and numerical simulation. The results show that optimized PCB restraint and using EC-2216 epoxy adhesive to strengthen CCGA can significantly reduce solder joint stress during random vibration. After reliability tests, using a small amount of EC-2216 epoxy adhesive to strengthen CCGA meets the reliability requirements of QJ 3086A—2016, the vibration resistance of solder joint is improved, and it has little influence on the thermal fatigue resistance. With the increase of epoxy adhesive amount, the thermal fatigue resistance of solder joints decrease significantly, and the high failure risk of solder joints exists in the service environment with large temperature difference. Under the condition of fully optimizing PCB board level constraints, using GD414 silicone rubber to reinforce the CCGA meets the high reliability assembly requirements of aerospace electronics. The above results provide reference for the reinforcement process of CCGA.
  • 赵智力, 孙凤莲, 王丽凤, 等. 低应力柔性CCGA焊点设计及其可靠性预测[J]. 焊接学报, 2012, 33(1): 53 − 56.

    Zhao Zhili, Sun Fenglian, Wang Lifeng, et al. Design of lower stress and flexible CCGA solder joints and reliability expectancy[J]. Transactions of the China Welding Institution, 2012, 33(1): 53 − 56.
    吕强, 尤明懿, 陈贺贤, 等. CCGA封装特性及其在航天产品中的应用[J]. 电子工艺技术, 2014, 35(4): 222 − 226.

    Lü Qiang, You Mingyi, Chen Hexian, et al. CCGA package characteristic and its application for space products[J]. Electronics Process Technology, 2014, 35(4): 222 − 226.
    王海超, 丁颖洁, 栾时勋, 等. 陶瓷柱栅阵列封装芯片落焊控温工艺研究[J]. 宇航材料工艺, 2020, 21(5): 9 − 15.

    Wang Haichao, Ding Yingjie, Luan Shixun, et al. Board-soldering temperature control process of CCGA packages after printed circuit board assembling for space applications[J]. Aerospace Materials & Tehnology, 2020, 21(5): 9 − 15.
    Reza Ghaffarian. CCGA packages for space application[J]. Microelectronics Reliability, 2006, 46: 2006 − 2024. doi: 10.1016/j.microrel.2006.07.094
    Andy Perkins, Sitaraman S K. Thermo-mechanical failure comparison and evaluation of CCGA and CBGA electronic packages[C]// Electronic Components and Technology Conference. Seattle, Washington, USA, 2003: 422 − 430.
    苏德志, 赵丹, 王岑. 温度试验条件下柱栅阵列仿真失效分析[J]. 微电子学, 2020, 50(1): 65 − 71.

    Su Dezhi, Zhao Dan, Wang Cen. Failure analysis of column grid array under temperature test[J]. Microelectronics, 2020, 50(1): 65 − 71.
    Ying Dong, Tian Ruyu, Wang Xiuli, et al. Coupling effects of mechanical vibration and thermal cycling ong reliability of CCGA solder joints[J]. Microelectronics Reliability, 2015, 55(11): 2396 − 2402. doi: 10.1016/j.microrel.2015.06.118
    Park Tae-Yong, Jeon Su-Hyeon, Kim Su-Jeong. Experimental validation of fatigue life of CCGA 624 package with initial contace pressure of thermal gap pads under random vibration excitation[J]. International Journal of Aerospace Engineering, 2018, 3: 1 − 12.
    Perkins A, Sitaraman S K. Analysis and prediction of vibration-induces solder joint failure for a ceramic column grid array package[J]. Journal of Electronic Packaging, 2008, 130(3): 1 − 11.
    夏卓杰, 张亮, 熊明月, 等. 有限元数值模拟在BGA/QFP/CCGA器件焊点可靠性研究中的应用[J]. 电子与封装, 2020, 20(2): 1 − 7.

    Xia Zhuojie, Zhang Liang, Xiong Mingyue, et al. Application of finite element numerical simulation in the reliability study of lead free solder joints in BGA/QFP/CCGA devices[J]. Electronics & Packaging, 2020, 20(2): 1 − 7.
    张莉. 焊锡钎料温度和应变率相关拉伸性能的本构描述[D]. 天津: 天津大学, 2004.

    Zhang Li. Constitutive description of temperature and strain rate dependent tensile behaviors of solder[D]. Tianjin: Tianjin University, 2004.
  • Related Articles

    [1]LIU Xudong, SA Zicheng, FENG Jiayun, LI Haozhe, TIAN Yanhong. The Development Status On Advanced Packaging Copper Pillar Bump Interconnection Technology and Reliability[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION. DOI: 10.12073/j.hjxb.20240718001
    [2]SONG Wei, MAN Zheng, XU Jie, WEI Shoupan, CUI Muchun, SHI Xiaojian, LIU Xuesong. Fatigue reliability analysis of load-carrying cruciform joints with misalignment effects[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(6): 20-26, 34. DOI: 10.12073/j.hjxb.20220629001
    [3]NAN Xujing, LIU Xiaoyan, CHEN Leida, ZHANG Tao. Effect of thermal cycling on reliability of solder joints of ceramic column grid array package[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2021, 42(2): 81-85. DOI: 10.12073/j.hjxb.20200331003
    [4]JIANG Nan, ZHANG Liang, LIU Zhiquan, XIONG Mingyue, LONG Weimin. Reliability analysis of thermal shock for SnAgCu solder joints of FCBGA devices[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(9): 39-42. DOI: 10.12073/j.hjxb.2019400232
    [5]TIAN Ye. Study on reliability of micro-solder joints for flip chip assemblies under thermal shock-crack growth mechanism[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(9): 43-45,50.
    [6]TIAN Ye. Micro-joint reliability of flip chip assembly under thermal shock-strain and stress[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(8): 67-70.
    [7]ZENG Chao, WANG Chunqing, TIAN Yanhong, ZHANG Wei. Effect of hot-cutting defect on reliability of brazing process in ceramic package manufacturing——Ⅱ. Brazing structure design[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2014, 35(11): 105-108.
    [8]GAO Lili, XUE Songbai, ZHANG Liang, SHENG Zhong. Finite element analysis on influencing factors of soldered column reliability in a CCGA device[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (7): 93-96.
    [9]LIU Xi. Fatigue reliability evaluation for welding construction containing welding defects[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (1): 89-92,96.
    [10]LIN Guoxiang, YE Jinbao, QIU Changjun. Calculating method of reliability on anti fatigue fracture of weld[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (1): 50-52.
  • Cited by

    Periodical cited type(1)

    1. 张璐霞, 林乃明, 邹娇娟, 谢瑞珍. 铝合金搅拌摩擦焊的研究现状. 热加工工艺. 2020(03): 1-6 .

    Other cited types(2)

Catalog

    Article views (538) PDF downloads (77) Cited by(3)

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return