Citation: | WANG Haichao, PENG Xiaowei, GUO Fan, DING Yingjie, CHEN Qiang. Research on reliability of CCGA reinforcement process for aerospace electronic products[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(7): 102-107. DOI: 10.12073/j.hjxb.20210907001 |
赵智力, 孙凤莲, 王丽凤, 等. 低应力柔性CCGA焊点设计及其可靠性预测[J]. 焊接学报, 2012, 33(1): 53 − 56.
Zhao Zhili, Sun Fenglian, Wang Lifeng, et al. Design of lower stress and flexible CCGA solder joints and reliability expectancy[J]. Transactions of the China Welding Institution, 2012, 33(1): 53 − 56.
|
吕强, 尤明懿, 陈贺贤, 等. CCGA封装特性及其在航天产品中的应用[J]. 电子工艺技术, 2014, 35(4): 222 − 226.
Lü Qiang, You Mingyi, Chen Hexian, et al. CCGA package characteristic and its application for space products[J]. Electronics Process Technology, 2014, 35(4): 222 − 226.
|
王海超, 丁颖洁, 栾时勋, 等. 陶瓷柱栅阵列封装芯片落焊控温工艺研究[J]. 宇航材料工艺, 2020, 21(5): 9 − 15.
Wang Haichao, Ding Yingjie, Luan Shixun, et al. Board-soldering temperature control process of CCGA packages after printed circuit board assembling for space applications[J]. Aerospace Materials & Tehnology, 2020, 21(5): 9 − 15.
|
Reza Ghaffarian. CCGA packages for space application[J]. Microelectronics Reliability, 2006, 46: 2006 − 2024. doi: 10.1016/j.microrel.2006.07.094
|
Andy Perkins, Sitaraman S K. Thermo-mechanical failure comparison and evaluation of CCGA and CBGA electronic packages[C]// Electronic Components and Technology Conference. Seattle, Washington, USA, 2003: 422 − 430.
|
苏德志, 赵丹, 王岑. 温度试验条件下柱栅阵列仿真失效分析[J]. 微电子学, 2020, 50(1): 65 − 71.
Su Dezhi, Zhao Dan, Wang Cen. Failure analysis of column grid array under temperature test[J]. Microelectronics, 2020, 50(1): 65 − 71.
|
Ying Dong, Tian Ruyu, Wang Xiuli, et al. Coupling effects of mechanical vibration and thermal cycling ong reliability of CCGA solder joints[J]. Microelectronics Reliability, 2015, 55(11): 2396 − 2402. doi: 10.1016/j.microrel.2015.06.118
|
Park Tae-Yong, Jeon Su-Hyeon, Kim Su-Jeong. Experimental validation of fatigue life of CCGA 624 package with initial contace pressure of thermal gap pads under random vibration excitation[J]. International Journal of Aerospace Engineering, 2018, 3: 1 − 12.
|
Perkins A, Sitaraman S K. Analysis and prediction of vibration-induces solder joint failure for a ceramic column grid array package[J]. Journal of Electronic Packaging, 2008, 130(3): 1 − 11.
|
夏卓杰, 张亮, 熊明月, 等. 有限元数值模拟在BGA/QFP/CCGA器件焊点可靠性研究中的应用[J]. 电子与封装, 2020, 20(2): 1 − 7.
Xia Zhuojie, Zhang Liang, Xiong Mingyue, et al. Application of finite element numerical simulation in the reliability study of lead free solder joints in BGA/QFP/CCGA devices[J]. Electronics & Packaging, 2020, 20(2): 1 − 7.
|
张莉. 焊锡钎料温度和应变率相关拉伸性能的本构描述[D]. 天津: 天津大学, 2004.
Zhang Li. Constitutive description of temperature and strain rate dependent tensile behaviors of solder[D]. Tianjin: Tianjin University, 2004.
|
[1] | LIU Xudong, SA Zicheng, FENG Jiayun, LI Haozhe, TIAN Yanhong. The Development Status On Advanced Packaging Copper Pillar Bump Interconnection Technology and Reliability[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION. DOI: 10.12073/j.hjxb.20240718001 |
[2] | SONG Wei, MAN Zheng, XU Jie, WEI Shoupan, CUI Muchun, SHI Xiaojian, LIU Xuesong. Fatigue reliability analysis of load-carrying cruciform joints with misalignment effects[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(6): 20-26, 34. DOI: 10.12073/j.hjxb.20220629001 |
[3] | NAN Xujing, LIU Xiaoyan, CHEN Leida, ZHANG Tao. Effect of thermal cycling on reliability of solder joints of ceramic column grid array package[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2021, 42(2): 81-85. DOI: 10.12073/j.hjxb.20200331003 |
[4] | JIANG Nan, ZHANG Liang, LIU Zhiquan, XIONG Mingyue, LONG Weimin. Reliability analysis of thermal shock for SnAgCu solder joints of FCBGA devices[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(9): 39-42. DOI: 10.12073/j.hjxb.2019400232 |
[5] | TIAN Ye. Study on reliability of micro-solder joints for flip chip assemblies under thermal shock-crack growth mechanism[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(9): 43-45,50. |
[6] | TIAN Ye. Micro-joint reliability of flip chip assembly under thermal shock-strain and stress[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(8): 67-70. |
[7] | ZENG Chao, WANG Chunqing, TIAN Yanhong, ZHANG Wei. Effect of hot-cutting defect on reliability of brazing process in ceramic package manufacturing——Ⅱ. Brazing structure design[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2014, 35(11): 105-108. |
[8] | GAO Lili, XUE Songbai, ZHANG Liang, SHENG Zhong. Finite element analysis on influencing factors of soldered column reliability in a CCGA device[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (7): 93-96. |
[9] | LIU Xi. Fatigue reliability evaluation for welding construction containing welding defects[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (1): 89-92,96. |
[10] | LIN Guoxiang, YE Jinbao, QIU Changjun. Calculating method of reliability on anti fatigue fracture of weld[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (1): 50-52. |
1. |
张璐霞, 林乃明, 邹娇娟, 谢瑞珍. 铝合金搅拌摩擦焊的研究现状. 热加工工艺. 2020(03): 1-6 .
![]() |