Finite element analysis on influencing factors of soldered column reliability in a CCGA device

ANSYS software was employed to establish threedimensional strip model of CCGA624 device and optimized simulation of soldered column dimension was also studied.Results indicate that the most dangerous soldered column locates in the furthest distance from the device center, and the strain concentration occurs in and around the interface between the eutectic solder and the Sn3.5Ag solder column where will be the foremost location for cracking.Optimization of soldered column dimensions show that the value of strain increase with the increase of column pitch;with increase of soldered column height the strain curves present parabolic-shaped and can acquire the minimum equivalent strain in the height of 2.07 mm;with the increase of soldered column diameter, the value of strain increases and the curve shows a clear monotone trend.In practical applications, proper soldered column dimension can be choosed based on the principle of smaller strain.