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CHEN Daming, HU Lifang, SHI Fangrong, MENG Qinsen. Mechanism and mechanical property of Si-glass-Si anodic bonding process[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(2): 123-127. DOI: 10.12073/j.hjxb.2019400054
Citation: CHEN Daming, HU Lifang, SHI Fangrong, MENG Qinsen. Mechanism and mechanical property of Si-glass-Si anodic bonding process[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(2): 123-127. DOI: 10.12073/j.hjxb.2019400054
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Mechanism and mechanical property of Si-glass-Si anodic bonding process

  • 1. Department of Materials Science and Engineering, Taiyuan University of Technology, Taiyuan 030024, China;

  • 2. Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan University of Technology, Taiyuan 030024, China

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  • Received Date: October 07, 2017
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    • Abstract
  • Si-glass-Si was successfully bonded together through a two-step anodic bonding process. The bonding current in each step of the two-step bonding process was investigated, and found to be quite different. The first bonding current decreased quickly to a relatively small value. But for the second bonding step, there were two current peaks, the current varified as decrease-increase-decreased rule. SEM was conducted to investigate the interfacial structure of the Si-glass-Si samples. Tensile tests indicated that the fracture occurred at the glass substrate and bonding strength increased with the increment of the bonding voltage.
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    • References (16)
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