Citation: | WANG Fu-liang, LI Jun-hui, HAN Lei, ZHONG Jue. Effect of bonding time on thick aluminum wire wedge bonding strength[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2006, (5): 47-51. |
[1] | LI Xiao, DU Yahong, GAO Liyin, YUAN Xiaohong, ZHOU Wenyan, KANG Feifei, LIU Zhiquan. Influence of plasma cleaning on the surface state and mechanical properties of Cu/Al wire bonding joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2024, 45(12): 14-19. DOI: 10.12073/j.hjxb.20231020002 |
[2] | WANG Shang, MA Jingxuan, YANG Dongsheng, XU Jiahui, HANG Chunjin, TIAN Yanhong. Research on the RF performance simulation of ultra-fine wire bonding of RF devices[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2021, 42(10): 1-7. DOI: 10.12073/j.hjxb.20201125001 |
[3] | JIANG Wei, CHANG Baohua, DU Dong, HUANG Hua, ZHOU Yunhong. Influence of wire materials and coating thickness on stress conditions in silicon substrate during copper thermosonic wire bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (3): 13-16. |
[4] | WANG Fuliang, HAN Lei, ZHONG Jue. Vibration frequency characters of chip and bonding on thermosonic flip chip bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (12): 43-46. |
[5] | LONG Zhi-li, WU Yun-xin, HAN Lei, ZHONG Jue. Multimode vibration analysis of transducer in thermosonic flip chip bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2006, (12): 21-24,28. |
[6] | HAN Lei, XU Wenhu, LI Hanxiong. Non-steady characteristics of ultrasonic bonding transducer system[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2006, (8): 19-22. |
[7] | WANG Quan, DING Jian-ning, XUE Wei, LING Zhi-yong. A novel instrument of silicon chip thermocompression outer wire bonding and jointing process research[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2006, (5): 61-64. |
[8] | WANG Fu-liang, HAN Lei, ZHONG Jue. A PZT driver signal acquisition and analysis system for ultrasonic wire bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2006, (1): 1-4,8. |
[9] | LONG Zhi-li, HAN lei, WU Yun-xin, ZHOU Hong-quan. Effect of different temperature on strength of thermosonic bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (8): 23-26,38. |
[10] | LI Jun-hui, HAN Lei, TAN Jian-ping, ZHONG Jue. Structure characteristics and evolution at wedge bonding interface[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (4): 5-8. |