Citation: | HAO Feifan, LI Mengwei, WANG Junqiang, JIN Li, GENG Hao. Application of selective anodic bonding technology in grating gyroscope[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2020, 41(12): 61-66. DOI: 10.12073/j.hjxb.20200419001 |
谷专元, 何春华, 何燕华, 等. MEMS硅玻璃阳极键合工艺评价方法[J]. 传感器与微系统, 2017(10): 54 − 56.
Gu Zhuanyuan, He Chunhua, He Yanhua, et al. MEMS silicon glass anode bonding process evaluation method[J]. Sensors and Microsystems, 2017(10): 54 − 56.
|
侯占强, 董培涛, 肖定邦, 等. 一种避免静电黏附失效的低应力阳极键合技术[J]. 纳米技术与精密工程, 2011(5): 74 − 78.
Hou Zhanqiang, Dong Peitao, Xiao Dingbang, et al. A low-stress anodic bonding technology to avoid electrostatic adhesion failure[J]. Nanotechnology and Precision Engineering, 2011(5): 74 − 78.
|
San H, Li Y, Song Z, et al. Self-packaging fabrication of silicon–glass-based piezoresistive pressure sensor[J]. IEEE Electron Device Letters, 2013, 34(6): 789 − 791.
|
Wenyin L, Xuezhong W, Dingbang X, et al. Characterization of signal transfer performance of a through glass via (TGV) substrate with silicon vertical feedthroughs[J]. Microelectronic Engineering, 2016, 165: 52 − 56.
|
Torunbalci M M, Alper S E, Akin T. A novel fabrication and wafer level hermetic sealing method for SOI-MEMS devices using SOI cap wafers[C]//IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2015), 2015: 409 − 412.
|
阮勇, 贺学锋, 张大成, 等. 微米尺度下键合强度的评价方法和测试结构[J]. 微电子学与计算机, 2005(8): 112 − 115.
Ruan Yong, He Xuefeng, Zhang Dacheng, et al. Evaluation method and test structure of bonding strength at the micrometer scale[J]. Microelectronics and Computers, 2005(8): 112 − 115.
|
Qiang X, Wenyin L, Xiangming X, et al. A novel high-sensitivity butterfly gyroscope driven by horizontal driving force[C]// IEEE Sensors, Glasgow, 2017: 2064 − 2071.
|
Reddy J, Pratap R. Si-gold-glass hybrid wafer bond for 3D-MEMS and wafer level packaging[J]. Journal of Micromechanics and Microengineering, 2017, 27(1): 015005.
|
Gao Y, Huang L, Ding X, et al. Design and implementation of a dual-mass MEMS gyroscope with high shock resistance[J]. Sensors, 2018, 18(4): 1037(1−18).
|
Xu L, Li H, Yang C, et al. Comparison of three automatic mode-matching methods for silicon micro-gyroscopes based on phase characteristic[J]. IEEE Sensors Journal, 2016, 16(3): 610 − 619.
|
Tez S, Akin T. Fabrication of a sandwich type three axis capacitive MEMS accelerometer[C]//IEEE Sensors, Baltimore, 2013: 1−4.
|
Xie J, Yang J, Zhou J. Vibrational energy loss analysis of a MEMS disk resonator gyroscope[C]//IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM), Auckland, 2018: 385 − 390.
|
VeenstraH T T, Berenschot J W, Gardeniers J G E, et al. Use of selective anodic bonding to create micropump chambers with virtually no dead volume[J]. Journal of the Electrochemical Society, 2001, 148(2): 68 − 2.
|
Wallis G, Pomerantz D I. Field assisted glass-metal sealing[J]. Journal of Applied Physics, 1969, 40(10): 3946 − 3949.
|
陈大明, 胡利方, 时方荣, 等. 硅-玻璃-硅阳极键合机理及力学性能[J]. 焊接学报, 2019, 40(2): 123 − 127.
Chen Daming, Hu Lifang, Shi Fangrong, et al. Silicon-glass-silicon anode bonding mechanism and mechanical properties[J]. Transactions of the China Welding Institution, 2019, 40(2): 123 − 127.
|
祁雪, 黄庆安, 秦明, 等. 单片集成MEMS中的阳极键合工艺[J]. 电子器件, 2005(4): 51 − 54.
Qi Xue, Huang Qingan, Qin Ming, et al. Anodic bonding process in monolithic integrated MEMS[J]. Electronic Devices, 2005(4): 51 − 54.
|
王喆垚. 微系统设计与制造[M]. 北京: 清华大学出版社, 2015.
Wang Zheyao. Microsystem design and manufacturing[M]. Beijing: Tsinghua University Press, 2015.
|
Nga P P, Boellard e, Pasqualina M, et al. Spin, spray coating and electrodeposition of photoresist for MEMS structures[J]. Journal of Micro Electro Mechanical Systems, 2004, 13(6): 491 − 499.
|
胡宇群, 董明佳. MEMS 阳极键合界面层的力学行为研究进展[J]. 南京航空航天大学学报, 2015, 47(4): 474 − 486.
Hu Yuqun, Dong Mingjia. Research progress of mechanical behavior of MEMS anode bonding interface layer[J]. Journal of Nanjing University of Aeronautics and Astronautics, 2015, 47(4): 474 − 486.
|
Zheng X, Yan X, Song Z, et al. Direct Al-Al contact in silicon-Pyrex7740 anodic bonding for hermetic package and electrical interconnecting[C]//2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Kaohsiung, 2011: 764 − 767.
|
[1] | XUE Yongzhi, HU Lifang, WANG Hao, LI Rong, WANG Wenxian. Electric current characteristic and mechanical properties of Si-glass-Al anodic bonding process[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(6): 71-76,86. DOI: 10.12073/j.hjxb.2019400157 |
[2] | CHEN Daming, HU Lifang, SHI Fangrong, MENG Qinsen. Mechanism and mechanical property of Si-glass-Si anodic bonding process[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(2): 123-127. DOI: 10.12073/j.hjxb.2019400054 |
[3] | CHEN Daming, HU Lifang, XUE Yongzhi, CHEN Shaoping, WANG Wenxian. Interfacial investigation and mechanical properties of Al-glass-Al anodic bonding process[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(9): 71-75. DOI: 10.12073/j.hjxb.2018390227 |
[4] | YIN Xu, LIU Cuirong, DU Chao, WU Changxiong. Effect of inorganic fillers on properties of polymer solid electrolyte and metal aluminum bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(11): 37-40. |
[5] | LIU Cuirong, MENG Qingsen, HU Lifang, HU Minying. Microstructure and bonding mechanism of anodic bonded interface between pyrex glass and kovar alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (2): 73-76. |
[6] | WANG Fu-liang, LI Jun-hui, HAN Lei, ZHONG Jue. Effect of bonding time on thick aluminum wire wedge bonding strength[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2006, (5): 47-51. |
[7] | LONG Zhi-li, HAN lei, WU Yun-xin, ZHOU Hong-quan. Effect of different temperature on strength of thermosonic bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (8): 23-26,38. |
[8] | ZOU Jia-sheng, XU Zhi-rong, ZHAO Qi-zhang, CHEN Zheng. Bonding strength of double partial transient liquid phase bonding with Si3N4/Ti/Cu/Ni/Cu/Ti/Si3N4[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (2): 41-44. |
[9] | Liu Huijie, Feng Jicai, Qian Yiyu. Interface Structures and Bonding Strength of SiC/TiAl Joints in Diffusion Bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1999, (3): 170-174. |
[10] | Feng Jicai, Liu Huijie, Han Shengyang, Li Zhuoran, Zhang Jiuhai. Interface Structures and Bonding Strength of SiC/Nb/SiC Diffusion Bonded Joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1997, (2): 20-23. |
1. |
李劲风,李昊然,王正安. 铝锂合金组织-性能相关性及新型铝锂合金设计. 中国材料进展. 2022(10): 796-807 .
![]() |