Citation: | QIU Xiliang, HAO Chengli, XIU Ziyang, HE Peng. Effect of graphene nanoplates on microstructure and properties of Sn-58Bi solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(4): 63-66,71. DOI: 10.12073/j.hjxb.20170415 |
赵玉琳. 铅污染对儿童健康的影响综述[J]. 安徽预防医学杂志, 2005, 8(3): 163-166. Zhao Yulin. Areview of lead pollution on children's health[J]. Journal of Anhui Preventive Medicine, 2005, 8(3): 163-166.
|
Yang L, Dai J, Zhang Y, et al. Influence of BaTiO3 nanoparticle addition on microstructure and mechanical properties of Sn-58Bi solder[J]. Journal of Electronic Materials, 2015, 44(7): 2473-2478.
|
Zhang C, Liu S, Qian G,et al. Effect of Sb content on properties of Sn-Bi solders[J]. Transactions of Nonferrous Metals Society of China, 2014, 24(1): 184-191.
|
夏志东, 雷永平, 史耀武. 绿色高性能无铅钎料的研究与发展[J]. 电子工艺技术, 2002, 23(5): 185-191. Xia Zhidong, Lei Yongping, Shi Yaowu.Research and development of green high performance lead-free solder[J]. Electronic Process Technology, 2002, 23(5): 185-191.
|
明 亮. 关于石墨稀材料在未来应用的前景及其制作工艺的研讨[J]. 科技创新与应用, 2013(19): 14-15. Ming Liang.Discussion on the prospect of graphene materials in the future and its manufacturing technology[J]. Science & Technology Innovation and Application, 2013(19): 14-15.
|
黄亦龙. 石墨烯+Sn-Ag-Cu复合钎料性能研究[D]. 哈尔滨: 哈尔滨工业大学, 2015.
|
陈国华. 石墨烯微片的制备及其产业化相关问题[C]//2010年全国高分子材料科学与工程研讨会学术论文集(上册). 南昌: 江西人民出版社, 2010: 327-328.
|
刘晓英. Sn基复合无铅钎料的研究[D]. 大连: 大连理工大学, 2010.
|
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