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YAN Lijing, ZHOU Minbo, ZHAO Xingfei. Effect of solidification condition and strain rate on tensile properties and fracture behavior of Sn-58Bi solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(5): 79-83. DOI: 10.12073/j.hjxb.2019400131
Citation: YAN Lijing, ZHOU Minbo, ZHAO Xingfei. Effect of solidification condition and strain rate on tensile properties and fracture behavior of Sn-58Bi solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(5): 79-83. DOI: 10.12073/j.hjxb.2019400131

Effect of solidification condition and strain rate on tensile properties and fracture behavior of Sn-58Bi solder

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  • Received Date: January 30, 2018
  • The tensile property and fracture behavior of the Sn-58Bi lead free solder solidified in water, air and furnace, respectively, are studied at different strain rate of 0.001, 0.002, 0.004 s–1. Results shown the eutectic structure of water cooling and air cooling Sn-58Bi solders is finer, in particular, the eutectic structure of air cooling solder is more uniform, while the eutectic structure of furnace cooling solder is coarse with serious microstructural segregation. The tensile strength of the solder becomes larger and the percentage elongation after fracture is smaller with increase of strain rate. Because of the accumulation of hard and brittle rich Bi which becomes from microstructural segregation in the Sn-58Bi solders, the tensile strength of furnace cooling solder is the maximum, however, its percentage elongation after fracture is the minimum, the fracture surface appears to be a typical brittle mode. The uniform eutectic structure can significantly improve the percentage elongation after fracture of the water cooling and air cooling Sn-58Bi solders, especially the percentage elongation after fracture of air cooling solder is maximum due to the best homogeneous eutectic organization, the fracture surface of air cooling solder is a brittle-ductility mixed fracture mode.
  • Ma Yong, Li Xuezheng, Yang Lizhuang, et al. Effects of graphene nanosheets addition on microstructure and mechanical properties of SnBi solder alloys during solid-state aging[J]. Materials Science&Engineering A, 2017, 696:437-444.
    Tao Q B, Benabou L, Vivet L, et al. Effect of Ni and Sb additions and testing conditions on the mechanical properties and microstructures of lead-free solder joints[J]. Material Science and Engineering:A, 2016, 669:403-416.
    Kotadia H R, Howes P D, Mannan S H. A review:on the development of low melting temperature Pb-free solders[J]. Microelectronics Reliability, 2014, 54(6-7):1253-1273.
    Chen Chihhao, Lee Boonho, Chen Hsiangchua, et al. Interfacial reactions of low-melting Sn-Bi-Ga solder alloy on Cu substrate[J]. Journal of Electronic Materials, 2016, 45:197-202.
    Silva B L, Reinhart G, Nguyen-Thi H, et al. Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn-Bi solder alloy[J]. Materials Characterization, 2015, 107(504):43-53.
    邱希亮,郝成丽,修子扬,等.石墨烯纳米片对Sn-58Bi钎料显微组织和性能的影响[J].焊接学报, 2017, 38(4):63-66 Qiu Xiliang, Hao Chengli, Xiu Ziyang, et al. Effect of graphene nanoplates on microstructure and properties of Sn-58Bi solders[J]. Transactions of the China Welding Institution, 2017, 38(4):63-66
    Suganuma K. Microstructural features of lift-off phenomenon in through-hole circuit soldered by Sn-Bi alloy[J]. Scripta Materialia, 1998, l38(9):1333-1340.
    Shen L, Septiwerdani P, Chen Z. Elastic moudulus, hardness and creep performance of SnBi alloy using nanoindentation[J]. Material Science and Engineering:A, 2012, 558(48):253-258.
    吕晓春,何鹏,张斌斌,等.凝固方式对Sn-Bi钎料组织和性能的影响[J].材料工程, 2010, 10:89-95 Lü Xiaochun, He Peng, Zhang Binbin, et al. Effect of solidification mode on microstructure and properties of Sn-Bi solders[J]. Journal of Materials Engineering, 2010, 10:89-95
    何鹏,吕晓春,张斌斌,等.合金元素对Sn-Bi无铅钎料组织及韧性的影响[J].材料工程, 2010, 10:13-17 He Peng, Lü Xiaochun, Zhang Binbin, et al. Effect of alloy element on microstructure and impact toughness of Sn-57Bi lead-free solders[J]. Journal of Materials Engineering, 2010, 10:13-17
    Chen Xu, Zhou Jian, Xue Feng, et al. Mechanical deformation behavior and mechanism of Sn-58Bi solder alloys under different temperatures and strain rates[J]. Materials Science and Engineering A, 2016, 662:251-257.
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