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WANG Chenxi, AN Rong, TIAN Yanhong, WANG Chunqing. Interfacial behavior between silver-plated copper wire and PCB pad during parallel micro gap welding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(11): 55-58.
Citation: WANG Chenxi, AN Rong, TIAN Yanhong, WANG Chunqing. Interfacial behavior between silver-plated copper wire and PCB pad during parallel micro gap welding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(11): 55-58.
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Interfacial behavior between silver-plated copper wire and PCB pad during parallel micro gap welding

  • 1.

    State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

  • 2.

    Key Laboratory of Micro-systems and Micro-structures Manufacturing, Ministry of Education, Harbin Institute of Technology Harbin 150080, China

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  • Received Date: December 11, 2015
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    • Abstract
  • Interfacial behavior between Ag-plated copper wire and Cu pads as well as Sn coated Cu pads on PCB (printed circuit board) were studied respectively during parallel micro gap welding process. Results show that Cu in the two sides of interfacial layer diffuses into Ag layer significantly at the interfaces of Ag/Cu joint. For Ag/Sn/Cu joint, the Sn distribution is influenced by Cu that diffuses into the Ag layer. Therefore, Sn concentration is higher at the top and the bottom of interface, but lower in the middle of interface. Although the Sn layer is very thin, it induces crack generation around the Ag-plated copper wire and decreases the bonding strength. The bonding strength of Ag/Sn/Cu joint is lower than that of Ag/Cu joint. For Ag-plated copper wires, the Cu pads are better for parallel micro gap welding rather than the Sn coated Cu pads on PCB.
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    • References (9)
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