Effect of Ti on the micro structures and properties of ceramic bonded joints with in term etallic compounds

In this paper, Si₃N₄ Ceramics were bonded with Ag-Cu-Ti and Ti/Ni/Ti multi-interlayer. The joints were strengthened by inter metallic compounds formed in situ. The results showed that the thickness of Ti foil has an important influence on the microstructures, properties of joints, and status of inter facial reaction layer. Thin Ti foil is favorable for form and distribution of inter metallic compounds, but harmful for formation of interfacial reaction layer. While thick Ti foil has adverse effect on form and distribution of inter metallic compounds and inter facial reaction layer.