Design of reflow oven furnace temperature based on quantum multi-objective optimization algorithm

The temperature trend of the welding center of circuit board indirectly reflects the welding quality. The optimization design of furnace temperature curve plays an important role in improving the welding quality of circuit board. In this paper, Fourier law and lumped parameter method were used to establish the unsteady heat conduction model reflecting the temperature change of the welding center of the circuit board. Under the constraints of meeting the process limits and technological requirements, the quantum multi-objective particle swarm optimization algorithm was used to optimize the solution with the goals of the optimal conveyor belt passing furnace speed and the minimum heating factor. The optimum temperature of each temperature region, the maximum passing speed of circuit board and the optimum temperature curve were obtained. The results show that the optimized circuit board passing through the furnace speed is 95.55 cm/min, which is close to the upper limit of the speed limit, and the minimum heating factor is 1 753.04. The furnace temperature curve shows a trend of rising first and then decreasing. The peak temperature is 240.01 ℃, which is close to the lower limit of the temperature process. The results provide strong guidance for practical engineering application and improvement of welding quality of electronic devices such as circuit boards.