Citation: | SUI Ran, LIN Qiaoli. Wetting behavior of monocrystalline Si by SnAgCu-xTi alloys[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2020, 41(4): 90-96. DOI: 10.12073/j.hjxb.20191122001 |
Awais A, Dong H G, Xia Y Q, et al. Lap joining Al5052 to Ti6Al4V by GTAW with AlSi5 filler wire[J]. China Welding, 2019, 28(2): 15 − 23.
|
朱永权, 张丽霞, 任伟, 等. 表面活化Al2O3陶瓷与5005铝合金真空钎焊[J]. 焊接学报, 2018, 39(11): 78 − 82.
Zhu Yongquan, Zhang Lixia, Ren Wei, et al. Vacuum brazing of active metallized Al2O3 ceramic to 5005 aluminum alloy[J]. Transactions of the China Welding Institution, 2018, 39(11): 78 − 82.
|
潘泽浩, 程战, 刘磊, 等. 石英玻璃飞秒激光微连接及其接头性能[J]. 焊接学报, 2016, 37(6): 5 − 8.
Pan Zehao, Cheng Zhan, Liu Lei, et al. Microwelding of fused silica by femtosecond laser and the joint mechanical properties[J]. Transactions of the China Welding Institution, 2016, 37(6): 5 − 8.
|
李文文, 熊华平, 吴欣, 等. Co-Nb-Pd-Ni-V钎料真空钎焊Cf/SiC复合材料的接头组织与性能[J]. 焊接学报, 2019, 40(9): 128 − 132.
Li Wenwen, Xiong Huaping, Wu Xin, et al. Microstructure and strength of the Cf/SiC composite joint brazed with Co-Nb-Pd-Ni-V filler alloy[J]. Transactions of the China Welding Institution, 2019, 40(9): 128 − 132.
|
Chen S J, Tang H J, Zhao P F. A two-step transient liquid phase diffusion bonding process of T91 steels[J]. China Welding, 2017, 26(2): 52 − 57.
|
Cheng L X, Li G Y, Wang X Q, et al. Influence of active element Ti on interfacial reaction and soldering strength between Sn3.5Ag4Ti(Ce,Ga) alloy filler and Si substrate[J]. Materials Science and Engineering: A, 2016, 658: 42 − 49. doi: 10.1016/j.msea.2016.01.100
|
Tsao L C, Chang S Y, Huang M S, et al. Direct robust active bonding between Al heat sink and Si substrate[C]//International Conference on Electronic Packaging Technology & High Density Packaging. Guilin: IEEE, 2012: 1635 − 1638.
|
Yu D Q, Wu C M L, Wong Y M, et al. Direct robust bonding between Sn-based solder and Si substrate[J]. Journal of Materials Science-Materials in Electronics, 2007, 18(10): 1057 − 1063. doi: 10.1007/s10854-006-9114-3
|
杨景卫, 曹彪, 柳健, 等. 压力对纯铜超声焊接界面行为的影响[J]. 焊接学报, 2018, 39(2): 53 − 56.
Yang Jingwei, Cao Biao, Liu Jian, et al. Effect of welding pressure on interfacial behavior of ultra-sonic-welded copper joints[J]. Transactions of the China Welding Institution, 2018, 39(2): 53 − 56.
|
Eustathopoulos N, Nicholas M G, Drevet B. Wettability at high temperatures[M]. Oxford: Elsevier, 1999.
|
Murarka S P, Fraser D B. Thin film interaction between titanium and polycrystalline silicon[J]. Journal of Applied Physics, 1980, 51(1): 342 − 349. doi: 10.1063/1.327378
|
Ogawa S I, Kouzaki T, Yoshida T, et al. Interface microstructure of titanium thin-film/silicon single-crystal substrate correlated with electrical barrier heights[J]. Journal of Applied Physics, 1991, 70(2): 827 − 832. doi: 10.1063/1.349641
|
闫文青, 张建强, 刘升. 氩弧熔敷Ti-Si-C系陶瓷涂层中物相的热力学预测[J]. 焊接学报, 2017, 38(5): 108 − 111.
Yan Wenqing, Zhang Jianqiang, Liu Sheng. Thermodynamic prediction for phases of ceramic coatings in Ti-Si-C system by argon arc depositing[J]. Transactions of the China Welding Institution, 2017, 38(5): 108 − 111.
|
Gosálvez M A, Nieminen R M. Surface morphology during anisotropic wet chemical etching of crystalline silicon[J]. New Journal of Physics, 2003, 5(1): 100.1 − 100.28.
|
Khanna A, Basu P K, Filipovic A, et al. Influence of random pyramid surface texture on silver screen-printed contact formation for monocrystalline silicon wafer solar cells[J]. Solar Energy Materials and Solar Cells, 2015, 132: 589 − 596. doi: 10.1016/j.solmat.2014.10.018
|
Koleňák R, Prach M. Research of joining brittle nonmetallic materials with an active solder[J]. Advances in Materials Science and Engineering, 2014, 2014: 1 − 9.
|
Liu X J, Niu Y C, Zhai T G, et al. Wettability investigating on the wet etching textured multicrystalline silicon wafer[J]. Applied Physics A, 2016, 122(2): 127.1 − 127.8.
|
[1] | HUANG Gang, ZHANG Qingdong, WANG Chunhai, ZHANG Boyang, KONG Ning. Experimental research on the blind hole-drilling method for measuring residual stress of steel plate[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2020, 41(9): 49-59, 80. DOI: 10.12073/j.hjxb.20200403002 |
[2] | FU Wei, FANG Hongyuan, BAI Xinbo, CHEN Guoxi. Effect of process paths on residual stress of multi-layer and multi-pass laser cladding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(6): 29-33. DOI: 10.12073/j.hjxb.2019400150 |
[3] | LI Hao, LI Hua. Release coefficients during measuring non-uniform residual stress with blind-hole method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (6): 85-88. |
[4] | WANG Xijing, Li Na, ZHANG Zhongke, Li Changri. FSW residual stress of aluminum alloy LY12[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (9): 81-84. |
[5] | MA Wenbo, CHEN Shuguang, LIU Huiqiong, LIN Wen, SHEN Yulong, LIU Jipu. FEM simulation of calibration on strain release coefficients in blind hole method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (2): 97-100. |
[6] | LI Hao, LIU Yihua. Residual stress field in hole-drilling method-part II:application[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (10): 33-36. |
[7] | LI Hao, LIU Yihua. Residual stress field in hole-drilling method-part I:Theoretical analysis[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (9): 46-50. |
[8] | MENG Xianlu, CHEN Huaining, LIN Quanhong, CHEN Jing. Stress-strain around an indentation in measuring residual stress by indentation-strain method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (3): 109-112. |
[9] | Chen Huaining, Chen Liangshan, Dong Xiuzhong. Drilling strains in measuring residual stress with hole-drilling strain-gage method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1994, (4): 276-280. |
[10] | Meng Gongge. Reliability and precision of blind hole drilling method for determining high residual stresses[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1991, (4): 235-238. |
1. |
丁鹏龙,陈雷,何亮,俞俊. 对接试板焊接残余应力实测与数值模拟. 材料开发与应用. 2023(02): 16-22 .
![]() | |
2. |
耿汝伟,程延海,杜军,魏正英. 2319铝合金电弧增材制造温度场与应力演变研究. 材料导报. 2023(23): 169-176 .
![]() | |
3. |
丁稳稳,高晓龙,刘晶. 残余应力检测方法研究现状. 宝鸡文理学院学报(自然科学版). 2022(01): 103-108 .
![]() | |
4. |
杨胜利,刘乐乐,李亚楠,沈健. 淬火及预拉伸对铝锂合金板材残余应力的影响. 中国有色金属学报. 2022(04): 975-985 .
![]() | |
5. |
甘世明,刘华荥,翟之平,韩永全. A review of welding residual stress test methods. China Welding. 2022(02): 45-55 .
![]() | |
6. |
秦闯,欧鹏,张思远,李永正,阮浩,荀金标,沈静,张曙光. 船用铝合金MIG焊接残余应力数值研究. 舰船科学技术. 2022(19): 63-68 .
![]() | |
7. |
郭旭东,吴运新,龚海,聂林,陈旦. 喷丸对2219铝合金TIG焊接残余应力的影响. 兵器材料科学与工程. 2021(02): 5-10 .
![]() | |
8. |
李在峥. 一种压痕深度测试装置的校准方法. 计量科学与技术. 2021(04): 49-51 .
![]() | |
9. |
梁广冰,朱锦洪,尹丹青,周杨凯,马宁,张柯柯. TC4钛合金激光熔覆路径选择数值模拟研究. 河南科技大学学报(自然科学版). 2021(06): 12-18+5 .
![]() | |
10. |
黄钢,张清东,王春海,张勃洋,孔宁. 钢板残余应力盲孔测量法试验及应用. 焊接学报. 2020(09): 49-59+80+99-100 .
![]() | |
11. |
甘世明,韩永全,陈芙蓉,李小飞. 基于弹性模量变化的7A52铝合金VPPA-MIG复合焊接残余应力测试. 焊接学报. 2019(05): 13-17+23+161 .
![]() |