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WANG Ting1, LI Hongjian1, JIANG Siyuan1, ZHANG Binggang2, FENG Jicai1,2. Microstructure and mechanical properties of EBWbrazed titanium to aluminum joint using AlSi5 filler wire[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(8): 1-4. DOI: 10.12073/j.hjxb.20150928001
Citation: WANG Ting1, LI Hongjian1, JIANG Siyuan1, ZHANG Binggang2, FENG Jicai1,2. Microstructure and mechanical properties of EBWbrazed titanium to aluminum joint using AlSi5 filler wire[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(8): 1-4. DOI: 10.12073/j.hjxb.20150928001

Microstructure and mechanical properties of EBWbrazed titanium to aluminum joint using AlSi5 filler wire

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  • Received Date: September 27, 2016
  • Electron beam weldingbrazing experiments of titanium to aluminum using AlSi5 filler wire were carried out in present paper. Microstructure and mechanical properties of welding joints were examined. The results showed that it was possible to join aluminum to titanium by electron beam welding with filler wire. Tensile strength reached 98.8 MPa, up to 96.7% of that of aluminum. The joint took on a typical weldingbrazing characteristic, which was composed of brazing joint at titanium side and welding joint at aluminum side. There was a Ti-Al intermetallic layer in the brazing joint with a thickness less than 2 μm, having weak impact on mechanical properties. Aluminum weld can be strengthened by dispersedly distributed IMCs. The lowest hardness value was in the HAZ, where fracture occurred during tensile test.
  • Sohn W H, Bong H H, Hong S H. Microstructure and bonding mechanism of Al/Ti bonded joint using Al-10Si-1Mg filler metal[J]. Materials Science and Engineering: A, 2003, 355(1): 231-240.[2] Chularis A A, Kolpachev A B, Kolpacheva O V,etal. Electron structure and properties of intermetallic compounds in titanium-metal dissimilar joints[J]. Welding International, 1995, 9(10): 812-814.[3] Li Y J, Wang J, Liu P,etal. Microstructure and XRD analysis near the interface of Ti/Al diffusion bonding[J]. International Journal for the Joining of Materials, 2005, 17(2): 53-57.[4] Hansen M,Anderko K, Salzberg H W. Constitution of binary alloys[J]. Journal of the Electrochemical Society, 1958, 105(12): 260C-261C.[5] Wang Ting, Li Xiaopeng, Zhang, Yongyunetal. Regulating the interfacial morphology of electron beam welded pure Ti/2024Al dissimilar joint[J]. Journal of Materials Processing Technology, 2017, 245: 227-231.[6] 兰 天, 董 鹏, 肖荣诗. 铝/钛异种合金激光深熔钎焊试验分析[J]. 焊接学报, 2010, 31(8): 109-112. Lan Tian, Dong Peng, Xiao Rongshi. Analysis of laser deep pentration brazing of aluminium and titanium alloy[J]. Transactions of the China Welding Institution.[7] Kreimeyer M, Wagner F, Vollertsen F. Laser processing of aluminum-titanium-tailored blanks[J]. Optics and Lasers in Engineering, 2005, 43(9): 1021-1035.[8] Sun Z, Karppi R. The application of electron beam weld for the joining of dissmilar metals: overview[J]. Journal of Materials Processing Technology, 1996, 59(3): 257-267.[9] 陈国庆, 张秉刚, 武振周, 等. TiAl/Ti60电子束焊接接头组织及性能[J]. 焊接学报, 2009, 30(12): 41-44. Cheng Guoqing, Zhang Binggang, We Zhenzhou,etal. Microstructure and mechanical properties of electron beam welded dissimilar Tial Ti60 joint[J]. Transactions of the China Welding Instiution, 2009,30(12): 41-44.
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