Citation: | SUN Jiantong, LI Xiaoyan, ZHANG Liang, YAO Wentao. Study of residual stress measurement of rolling aluminum alloy using x-Ray diffraction method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(1): 61-64. |
李亚江. 轻金属焊接技术[M]. 北京:国防工业出版社, 2011.
|
陈会丽, 钟毅, 王华昆, 等. 残余应力测试方法的研究进展[J]. 云南冶金. 2005, 34(3):52-54. Chen Huili, Zhong Yi, Wang Huakun, et al. Research progress of the method for residual stress measurement[J]. Yunnan Metallurgy. 2005, 34(3):52-54.
|
Pariente IF, Guagliano M. Contact fatigue damage analysis of shot peened gears by means of X-ray measurements[J]. Engineering Failure Analysis, 2009, 16(3):964-971.
|
陈玉安, 周上祺. 残余应力X射线测定方法的研究现状[J]. 无损检测, 2001, 23(1):19-22. Chen Yuan, Zhou Shangqi. The-state-of-the art of the study on residual stress measurement by X-ray analysis[J]. Nondestructive Testing, 2001, 23(1):19-22.
|
Tang Wu, Deng Longjiang, Xu Kewei, et al. X-ray diffraction measurement of residual stress and crystal orientation in Au/NiCr/Ta films prepared by plating[J]. Surface & Coatings Technology, 2007, 201(12):5944-5947.
|
Houtte P V, Buyser L D. The influence of crystallographic texture on diffraction measurements of residual stress[J]. Acta Metall Mater, 1993, 41(2):323-336.
|
余利根, 何家文, Hendrix B C. 择优取向对X射线应力测试的影响[J]. 金属学报, 1998, 34(6):667-672. Yu Ligen, He Jiawen, Hendrix B C. The effect of preferred orientation on X-ray stress measurement[J]. Acta Metallurgica Sinica, 1998, 34(6):667-672.
|
张锭铨, 何家文. 材料中残余应的X射线衍射分析和作用[M]. 西安:西安交通大学出版社,1999.
|
毛卫民, 杨平, 陈冷. 材料织构分析原理与检测技术[M]. 北京:冶金工业出版社, 2008.
|
徐可为, 何家文. 立方晶系织构材料残余应力测定的H晶面衍射法[J]. 稀有金属材料与工程. 1989(5):7-13. Xu Kewei, He Hiawen. Cubic crystal system texture material H crystal plane diffraction method for the determination of residual stress[J]. Rare Metal Materials and Engineering, 1989(5):7-13.
|
[1] | CHI Luxin, HUANG Yan, XU Huibin, GU Lingxiang, ZHANG Yuhu, RAN Yang, WU Jiangchuan. Analysis on interface characteristics and metal particle distributions in electromagnetic pulse welding with aluminum to steel[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(5): 36-43. DOI: 10.12073/j.hjxb.20220523001 |
[2] | HUANG Huizhen, ZHAO Yanan, PENG Ruyi, DUAN Yuande. Growth kinetics of intermetallic compounds formation between liquid Sn-9Zn-0.1S solders and Cu substrates interface[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(6): 23-28. DOI: 10.12073/j.hjxb.2019400149 |
[3] | LIU Ning, HUANG Jiankang, CHEN Manjiao, SHI Yu, CAO Rui. Growth analysis of intermetallic compounds on aluminum-steel MIG-brazing interface based on Monte Carlo method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(2): 55-58,62. |
[4] | TIAN Ye, WU Yiping, AN Bing, LONG Danfeng. Evolution of interfacial intermetallic compound in small solder joint of fine pitch flip chip during reflow[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (10): 100-104. |
[5] | LI Xiaoquan, CHU Yajie, YANG Zonghui. Research on controlling method of size and distribution of oxide inclusions in weld metal with auxiliary electric field[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (10): 5-8. |
[6] | YANG Yang, LU Hao, YU Chun, CHEN Junmei, CHEN Zhenying. Effect of Zn on formation of voids on SnxZn/Cu interface[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (1): 53-56. |
[7] | MENG Gongge, YANG Tuoyu, CHEN Leida, WANG Shizhen, LI Caifu. Effect of Ge on the SnAgCu/Cu soldering interface[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (7): 51-53,56. |
[8] | QI Lihua, HUANG Jihua, ZHAO Xingke, ZHANG Hua. Growth behavior of compounds at Sn3.5Ag0.5Cu/Ni under thermal-shearing cycling[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (12): 61-64. |
[9] | LIU Xiuzhong, LI Shitong, CHEN Libo. Distribution and diffusion mechanism of Sn in interface of ZA alloy soldered joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (12): 51-55. |
[10] | HE Peng, ZHANG Jiu-hai, FENG Ji-cai, QIAN Yi-yu. Numeric Simulation for Interface Intermetallic Compounds of Phase Transformation Diffusion Bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2000, (3): 75-78. |
1. |
汪松英,李志豪,曾世堂,洪少健,丘翰琳,苏慧珍,杜昆. 功率模块封装的纳米银焊膏烧结工艺气氛影响研究. 广州化工. 2025(08): 91-94 .
![]() | |
2. |
奚思,刘斌,蔡传辉,李金伟,陆玉. 纳米银烧结设备热压系统设计及仿真分析. 电子工业专用设备. 2025(02): 6-9+30 .
![]() | |
3. |
李志豪,汪松英,洪少健,孙啸寒,曾世堂,杜昆. 镀银板表面粗糙度对纳米银焊膏快速烧结互连质量的影响. 电子与封装. 2024(07): 5-11 .
![]() | |
4. |
鲍金祥,关俊卿,何金江,王鹏,侯智超. 大功率器件低温烧结纳米银膏的研究进展. 贵金属. 2024(S1): 71-77 .
![]() | |
5. |
黄玺,张亮,王曦,陈晨,卢晓. 电子封装用纳米级无铅钎料的研究进展. 材料导报. 2024(23): 136-148 .
![]() | |
6. |
汪智威,林丽婷,李欣. 低温烧结银与金基界面互连研究进展. 焊接学报. 2023(12): 116-123+143-144 .
![]() |