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TIAN Ye, WU Yiping, AN Bing, LONG Danfeng. Evolution of interfacial intermetallic compound in small solder joint of fine pitch flip chip during reflow[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (10): 100-104.
Citation: TIAN Ye, WU Yiping, AN Bing, LONG Danfeng. Evolution of interfacial intermetallic compound in small solder joint of fine pitch flip chip during reflow[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (10): 100-104.
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Evolution of interfacial intermetallic compound in small solder joint of fine pitch flip chip during reflow

  • 1.

    Henan University of Technology, School of Mechanical and Electrical Engineering, Zhengzhou 450000, China;School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

  • 2.

    School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

  • 3.

    Department of Precision Instruments and Mechanology, Tsinghua University, Beijing 100084, China

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  • Received Date: July 19, 2012
    Graphical Abstract
    • Abstract
  • Through the cyclic load-unload test of nano-indentation method,the effects of maximum load on cycling mechanics behavior for two kinds micro-solder joints of Sn-3.0Ag- 0.5Cu/Cu and Sn-0.3Ag-0.7Cu/Cu were investigated.The results indicated that the cycling F-h curves that before closed showed a hysteresis loop.The area of hysteresis loop and indentation residual depth of micro-soldered joints increased with the increase of the maximum load.The cumulative damage of microsoldered joints increased.When the maximum load was given, the area of hysteresis loop and increments of residual indentation depth decreased gradually with the loading time increasing.Indentation creep C of micro-soldered joints decreased with the increase of the maximum load.At the same time,indentation creep C of micro-soldered joints sharply decreased at first and then plateaued with the loading time increasing.Indentation creep C of Sn-3.0Ag-0.5Cu/Cu micro-soldered joint was less than that of Sn-0.3Ag-0.7Cu/Cu micro-soldered joint.
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