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QI Lihua, HUANG Jihua, ZHAO Xingke, ZHANG Hua. Growth behavior of compounds at Sn3.5Ag0.5Cu/Ni under thermal-shearing cycling[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (12): 61-64.
Citation: QI Lihua, HUANG Jihua, ZHAO Xingke, ZHANG Hua. Growth behavior of compounds at Sn3.5Ag0.5Cu/Ni under thermal-shearing cycling[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (12): 61-64.
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Growth behavior of compounds at Sn3.5Ag0.5Cu/Ni under thermal-shearing cycling

  • School of Material Science and Engineering, Beijing University of Science and Technology, Beijing 100083, China

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  • Received Date: April 05, 2007
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  • The atoms diffusion and growth behavior of intermetallic compound (IMC)at Sn3.5Ag0.5Cu/Ni interface after thermal-shearing cy cling (25-125℃)were investigated, which was compared to compound growth behavior under isothermal aging condition. The results showed that there is a type of (CuxNi1-x)6Sn5 IMC formed at the interface after reflowing, and the morphology of compound changes from scallop-like with the cycling increasing. There is another kind of compound (NixCu1-x)Sn3 formed surrounding (CuxNi1-x)6Sn5 after 200 cycles and grow up rapidly as planarlike.As the thermal-shearing cycling increasing, Ag3Sn formed uniform particles after reflowing congregates to grow up to chunk-like in the solder.The IMC at the interface growth follows a parabolic growth kinetiscs with the thermal-shearing cycling increasing, implying that it was controlled by Cu atom diffusion.
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