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DENG Jingquan, WU Yucheng, Zong Yue, WANG Wenfang, HUANG Xinmin, YU Fuwen. Microstructure and properties of copper alloy based nano composite for spot welding electrode[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (11): 58-60,64.
Citation: DENG Jingquan, WU Yucheng, Zong Yue, WANG Wenfang, HUANG Xinmin, YU Fuwen. Microstructure and properties of copper alloy based nano composite for spot welding electrode[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (11): 58-60,64.
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Microstructure and properties of copper alloy based nano composite for spot welding electrode

  • 1.

    School of Materials and Engineering, Hefei University of Technology, Hefei 230009, China;School of Materials and Engineering, Zhejiang University, Hangzhou 310007, China

  • 2.

    School of Materials and Engineering, Hefei University of Technology, Hefei 230009, China

  • 3.

    Materials corporation, Hefei University of Technology, Hefei 230009, China

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  • Received Date: January 22, 2007
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    • Abstract
  • Copper alloy-based composites were successfully prepared using PM method with mechanically alloyed powders for spot welding electrode(CuCrZr/AlN).Microstructure and properties were characterized using transmission electron microscope, scanning electron microscope etc.Their electrical conductivity, thermal conductivity and softening temperature were measured.Results show that with the increasing of the contents of AlN, the electrical and thermal conductivity both decrease while the softening temperature increases. When the content of AlN is 0.4wt%, its softening temperature reaches 900℃, while its electrical conductivity is about 45%IACS (international annealling copper standard) and its thermal conductivity is about 197 W/m·K.When the content of AlN is 0.2wt%, the composite has good comprehensive properties and is suitable for spot welding electrode.
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