Citation: | XUE Song-bai, HU Yong-fang, YU Sheng-lin, WU Yu-xiu. Effects of thermal cycling on shear strength and microstructures of soldered joints of ceramic ball grid array package[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2006, (6): 1-4. |
[1] | HUANG Huizhen, ZHAO Yanan, PENG Ruyi, DUAN Yuande. Growth kinetics of intermetallic compounds formation between liquid Sn-9Zn-0.1S solders and Cu substrates interface[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(6): 23-28. DOI: 10.12073/j.hjxb.2019400149 |
[2] | QIU Xiliang, WANG Qian, LIN Tiesong, HE Peng, LU Fengjiao. Effect of Al18B4O33 whiskers on microstructure evolution of intermetallic compound layer and shear behavior of soldered joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(8): 35-38. |
[3] | WANG Jianhua, MENG Gongge, SUN Fenglian. Study on growth rate of interfacial metallic compound in SAC305/Cu joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(5): 47-50,76. |
[4] | TIAN Ye, WU Yiping, AN Bing, LONG Danfeng. Evolution of interfacial intermetallic compound in small solder joint of fine pitch flip chip during reflow[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (10): 100-104. |
[5] | QIN Fei, AN Tong, ZHONG Weixu, LIU Chengyan. Nanoindentation properties of intermetallic compounds in lead-free solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (1): 25-28,32. |
[6] | QI Kai, WANG Fengjiang, LAI Zhongmin. Inhibition growth of intermetallic compounds at solder/Cu of by addition of Zn into Sn-3.5Ag[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (10): 57-60. |
[7] | ZHANG Deku, WANG Kehong, ZHANG Jing, ZHAO Nan. Effect of process parameters on strengthening of steel surface with Fe-Al intermetallic compounds[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (12): 85-88. |
[8] | ZHU Dongmei, WANG Xibao. Mcrostrueture of Fe3A1 intermetallic compound produced by plasma cladding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (12): 17-19,24. |
[9] | REN Zhen'an, ZHAO Jiyuan, FAN Jun, HONG He. Microsturctures and properties of Ti-Si intermetallic compound layers by arc cladding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (11): 1-4. |
[10] | QI Lihua, HUANG Jihua, ZHAO Xingke, ZHANG Hua. Growth behavior of compounds at Sn3.5Ag0.5Cu/Ni under thermal-shearing cycling[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (12): 61-64. |