Citation: | DONG Hong-gang, GAO Hong-ming, WU Lin. Numerical Simulation of Heat Transfer Based on PHOENICS During Stationary Plasma Arc Welding Process[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2002, (4): 24-26,30. |
[1] | WANG Xiaowei, WANG Fengjiang. Size effect behavior of microstructure and mechanical properties in Sn-58Bi micro solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(12): 70-74, 81. DOI: 10.12073/j.hjxb.20230613008 |
[2] | YANG Weiran, JI Tongtong, DING Yu, WANG Fengjiang. Effect of Bi addition on interfacial microstructures and properties of Sn-1.0Ag-0.5Cu Pb-free solder joints during isothermal aging and thermal cycling[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(11): 157-162. DOI: 10.12073/j.hjxb.20220709003 |
[3] | QIU Xiliang, HAO Chengli, XIU Ziyang, HUANG Yilong, WU Gaohui, HE Peng. Preparation and properties of Y2O3/Sn-58Bi composite solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(1): 91-94. |
[4] | XING Fei, QIU Xiaoming, ZHANG Hongqiang, YIN Shanwen. Microstructure and properties of Zn-Cu-Sn-Bi high-temperature solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(5): 77-80,108. |
[5] | CHEN Zhihao, ZHENG Wei, ZHU Xiebin, ZU Fangqiu. Effects of Sn-Bi-Cu alloy melt structure change on solidification[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (10): 61-64. |
[6] | HE Hongwen, XU Guangchen, GUO Fu. Mechanism investigation of Bi layer formation at anode interface in Cu/Sn-58Bi/Cu solder joint induced by electromigration[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (10): 35-38,42. |
[7] | ZHOU Jian, FU Xiaoqing, SUN Yangshan, DING Kejian. Microstructure and properties of Sn-Zn-Bi-(P,Nd) lead-free solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (9): 45-48. |
[8] | SUN Fenglian, HU Wengang, WANG Lifeng, MA Xin. Influence of Bi on the melting point and wettability of Sn-0.3Ag-0.7Cu lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (10): 5-8. |
[9] | WANG Lifeng, SUN Fenglian, LIU Xiaojing, LIANG Ying. Design of Sn-Ag-Cu-Bi solder alloy and analysis on microstructure and properties[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (7): 9-12. |
[10] | Feng Jicai, Liu Huijie, Han Shengyang, Li Zhuoran, Zhang Jiuhai. Interface Structures and Bonding Strength of SiC/Nb/SiC Diffusion Bonded Joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1997, (2): 20-23. |