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XING Fei, QIU Xiaoming, ZHANG Hongqiang, YIN Shanwen. Microstructure and properties of Zn-Cu-Sn-Bi high-temperature solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(5): 77-80,108.
Citation: XING Fei, QIU Xiaoming, ZHANG Hongqiang, YIN Shanwen. Microstructure and properties of Zn-Cu-Sn-Bi high-temperature solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(5): 77-80,108.
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Microstructure and properties of Zn-Cu-Sn-Bi high-temperature solders

  • 1.

    Department of Material Science and Engineering, Jilin University, Changchun 130025, China

  • 2.

    San You Automobile Parts Manufacturing Co., Ltd., Changchun 130000, China

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  • Received Date: November 04, 2013
    Graphical Abstract
    • Abstract
  • In order to develop high temperature solders for brazing Cu and steel,a series of Zn-2Cu-Sn-Bi (wt-%) solders have been investigated. Through differential scanning calorimeter (DSC) analysis, the thermal properties of Zn-Sn-Cu-Bi solders were measured. The results showed that the solidus and liquidus temperatures of Zn-2Cu-Sn-Bi solders are 386.00-391.80 ℃ and 398.64-401.50 ℃, respectively, and the under-cooling temperatures are between 9.37 ℃ and 12.64 ℃. The wettability tests showed that the increase of Sn in Zn-2Cu-Sn-2Bi solders resulted in the increase of wetting area. The average wetting area was a of 206 mm2, and the smallest contact angle was of 5°. The metallographic observations indicated that Zn-2Cu-Sn-Bi solder consisted of η-Zn matrix, dendrite β-Sn crystals, Bi phaseand ε-CuZn5 intermetallic compounds. The Zn-Cu compounds were formed in the joints. The interfacial layer was about 80 μm thick, with one scallop-shaped ε-CuZn4/CuZn5 layer, and two flat layers β-CuZn and γ-Cu5Zn8.
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    • References (10)
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