Citation: | YANG Xuexia, SUN Qinrun, ZHANG Weiwei. Structure optimization design of BGA solder joints based on surface response method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(11): 36-41. DOI: 10.12073/j.hjxb.20220810002 |
Due to low cost and good electrical performance, BGA packaging is widely used in integrate circuit (IC) industry. Finite element method (FEM) analysis was carried out for evaluation of stress distribution in the Ball Grid Array (BGA) solder joints, and the radial scale, the height, the spacing of the solder joints, the height of chip were selected as design factors. Response surface methodology (RSM) was used to generate 25 designs and finite element modeling was employed to simulate the response of the assemblies to reliability influencing simulation calculations. The equation regression was associated with genetic algorithm (GA) to search for an optimal combination of parameters that meet the thermal vibration quality characteristics. The confirmation results showed that the space played a role in the reliability, and the radical scale 0.28 mm, the height 0.20 mm, the spacing 0.4mm settings of produce optimal assembly which demonstrated potential of reducing equivalent stress of the best design by 11.92%, respectively. The aim of optimizing BGA solder joints parameters was succeeded.
[1] |
王建培, 黄春跃, 梁颖, 等 基于回归分析和遗传算法的BGA焊点功率载荷热应力分析与优化[J]. 电子学报, 2019, 47 (3): 734-740.
Wang Jianpei, Huang Chunyue, Liang Ying, et al. Thermal stress analysis and optimization of BGA solder joint power load based on regression analysis and genetic algorithm [J]. Chinese Journal of Electronics, 2019, 47 (3): 734-740.
|
[2] |
Mršnik Matjaž, Slavič Janko, Boltežar Miha. Multiaxial vibration fatigue—A theoretical and experimental comparison[J]. Mechanical Systems and Signal Processing, 2016, 76: 409 − 423.
|
[3] |
Xia Jiang, Yang Lin, Liu Qunxing, et al. Comparison of fatigue life prediction methods for solder joints under random vibration loading[J]. Microelectronics Reliability, 2019, 95: 58 − 64. doi: 10.1016/j.microrel.2019.02.008
|
[4] |
Xia Jiang, Li Guoyuan, Li Bin, et al. Optimal design for vibration reliability of package-on-package assembly using FEA and taguchi method[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(10): 1482 − 1487. doi: 10.1109/TCPMT.2016.2611622
|
[5] |
韩立帅, 黄春跃, 梁颖, 等. 3D封装微尺度CSP焊点随机振动应力应变分析[J]. 焊接学报, 2019, 40(6): 64 − 70. doi: 10.12073/j.hjxb.2019400156
Han Lishuai, Huang Chunyue, Liang Ying, et al. Random vibration stress-strain analysis of 3D packaging microscale CSP solder joints[J]. Transactions of the China Welding Institution, 2019, 40(6): 64 − 70. doi: 10.12073/j.hjxb.2019400156
|
[6] |
黄春跃, 赵胜军, 梁颖, 等. CSP焊点焊后残余应力分析与预测[J]. 电子科技大学学报, 2021, 50(1): 148 − 154.
Huang Chunyue, Zhao Shengjun, Liang Ying, et al. Analysis and prediction of post-welding residual stress in CSP solder joints[J]. Journal of University of Electronic Science and Technology of China, 2021, 50(1): 148 − 154.
|
[7] |
Cho Minjin, Kim Sujin, Joun Man Soo. Optimal process design of an optimal, single-stage, symmetrical L-bending process employing taguchi method with finite element method, and experimental verification thereof[J]. International Journal of Precision Engineering and Manufacturing, 2022, 23(4): 395 − 404. doi: 10.1007/s12541-022-00631-4
|
[8] |
Zhang Z-H, Wang X-S, Ren H-H, et al. Simulation study on thermo-fatigue failure behavior of solder joints in PoP structure[J]. Microelectronics Reliability, 2017, 75: 127 − 134. doi: 10.1016/j.microrel.2017.06.033
|
[9] |
Liang Z, Xue S, Gao L, et al. Thermal Fatigue Behavior of SnAgCu Soldered Joints in Fine Pitch Devices[J]. Rare Metal Materials and Engineering, 2010, 39(3): 382 − 387. doi: 10.1016/S1875-5372(10)60084-7
|
[1] | FU Kuijun, ZHAO Jingwei, GAO Mingze, LENG Xuesong, YAN Jiuchun. Grain growth and phase transformation in the welded joint HAZ of TiNbV microalloyed steel[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2020, 41(3): 17-22. DOI: 10.12073/j.hjxb.20190715004 |
[2] | ZHENG Huaibei, YE Xiaoning, ZHANG Xuefeng, JIANG Laizhu, LIU Zhenyu, WANG Guodong. Microstructure transformation,grain growth and precipitated phase of 12%Cr ferritic stainless steel in coarse grain zone[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (6): 37-40. |
[3] | ZHANG Genyuan, XU Maili, TIAN Songya, Wen Fang. Genetic algorithm of grain growth in heat-affected zone of 45 steel AC flash butt welding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (6): 79-82. |
[4] | LI Yubin, MENG Daqiao, LIU Kezhao, XIE Zhiqiang. Simulation of the microstructure evolution of welding-grain growth in heat affected zone[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (1): 25-28,32. |
[5] | WU Wei, GAO Hongming, CHENG Guangfu, WU Lin. Grain growth in heat affected zone of fine grained titanium alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (10): 57-60, 64. |
[6] | ZHANG Guifeng, MIAO Huixia, ZHANG Jianxun, PEI Yi, WANG Jian, ZHANG Yantao. Effects of immediate water cooling and normalization after welding on microstructure and hardness of heat affected zone of ultra-fine grain steels welded joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (12): 47-50. |
[7] | WEN Jun qin, LIU Xin tian, MO Chun li, ZHANG Shi xing. Microstructure simulation of grain growth in heat affected zone[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2003, (3): 48-51. |
[8] | QU Zhao-xia, TIAN Zhi-ling, DU Ze-yu. The HAZ Grain Growth Diagram of the New Generation Steel with Yield Strength 400 Mpa[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2002, (3): 29-31. |
[9] | QU Zhao-xia, TIAN Zhi-ling, DU Ze-yu, HE Chang-hong, ZHANG Xiao-mu, YANG Bai. Grain Growth in HAZ of Ultra-fine Grain Steels[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2000, (4): 9-12. |
[10] | SUN Jun-sheng, WU Chuan-song, Li Ya-jiang. Welding Heat Transfer of GMAW and Its Effects on Austenite Grain Growth Process in HAZ[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2000, (3): 27-31. |