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SUN Fenglian, LI Tianhui, HAN Bangyao. Anti-aging performance of Sn5Sb1Cu0.1Ni0.1Ag/Ni solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2020, 41(2): 28-32. DOI: 10.12073/j.hjxb.20190929001
Citation: SUN Fenglian, LI Tianhui, HAN Bangyao. Anti-aging performance of Sn5Sb1Cu0.1Ni0.1Ag/Ni solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2020, 41(2): 28-32. DOI: 10.12073/j.hjxb.20190929001
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Anti-aging performance of Sn5Sb1Cu0.1Ni0.1Ag/Ni solder joints

  • Harbin University of Science and Technology, Harbin, 150040, China

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  • Received Date: September 28, 2019
  • Available Online: July 12, 2020
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    • Abstract
  • In this paper, SEM was used to study the interfacial diffusion behavior of Cu/Sn5Sb1Cu0.1Ni0.1Ag/Cu and Ni/Sn5Sb1Cu0.1Ni0.1Ag/Ni solder joints under isothermal aging at 150 ℃. The results showed that the morphology of intermetallic compound (IMC) at Cu/Sn5Sb1Cu0.1Ni0.1Ag/Cu solder joint grew from thin needle-shaped to rod-shaped and the thickness of IMC increased with aging time increasing. The main composition of IMC was (Cu,Ni)6Sn5. The appearance of IMC at Ni/Sn5Sb1Cu0.1Ni0.1Ag/Ni solder joints changed from horst shaped to relatively granular shaped, and the thickness of IMC increased. The main composition of IMC was (Cu,Ni)3Sn4. The growth rate of IMC at interface of Sn5Sb1Cu0.1Ni0.1Ag/Cu solder joint was 7.39 × 10−2 μm2/h, and that at interface of Sn5Sb1Cu0.1Ni0.1Ag/Ni was 2.06 × 10−2 μm2/h. Nickel-plating significantly changed the morphology of IMC, reduced the growth rate of IMC, inhibited the growth of IMC, and significantly improved the aging resistance.
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    • References (10)
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