Advanced Search
ZHAO Zhili, LIU Xin, LI Rui, WANG Peng. Study on solder joint of SAC0307 solder paste reinforced by nano Ag/Cu particles[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(9): 95-98. DOI: 10.12073/j.hjxb.2018390231
Citation: ZHAO Zhili, LIU Xin, LI Rui, WANG Peng. Study on solder joint of SAC0307 solder paste reinforced by nano Ag/Cu particles[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(9): 95-98. DOI: 10.12073/j.hjxb.2018390231
shu

Study on solder joint of SAC0307 solder paste reinforced by nano Ag/Cu particles

  • School of Material Science & Engineering, Harbin University of Science and Technology, Harbin 150040, China

More Information
  • Received Date: June 10, 2017
    Graphical Abstract
    • Abstract
  • The influence of nano-particles addition on the microstructure and mechanical properties of soldering joint of low silver SAC0307 soldering paste was studied. The results show that the island-like Cu6Sn5 phase exists in a larger size and is difficult to keep dispersion in solder eutectic regions with the addition of nano-Cu. When the additive amount of nano-Cu exceeded 0.3%, the Cu6Sn5 phase was easy to accumulate, merge and grow up in the liquid/gas interface. This behavior leaded the deterioration of the flowability of solder, and produced large amount of pores because the flux gas in the solder paste is difficult to escape during the soldering process. While there is no pores in solder joints with 0.1%~5.0% nano-Ag addition. The Ag3Sn phase exists in a tiny size and diffuses distribution in these solder eutectic regions, and the β-Sn primary crystals are refined significantly in solder joints. With the increase of nano-Ag addition, the shear strength increases firstly and then decreases. when the addition is 0.5% the shear strength is the largest, meaning the shear strength in this addition is 30.8% higher than the shear strength of solder joint the SAC0307 solder paste under the same conditions.
    • FullText(HTML)
    • References (9)
  • Jiun H H, Leng E P, Ding M, et al. A study on lead free SnAgCu solder system[C]//International Electronic Manufacturing Technology, Putrajaya Malaysia, Institute of Electrical and Electronics Engineers Inc. 2006:450-455.
    刘平, 顾小龙, 赵新兵, 等. 不同Ag元素含量Sn-Ag-Cu无铅钎料性能分析[J]. 焊接学报, 2012, 33(6):55-58 Liu Ping, Gu Xiaolong, Zhao Xinbing, et al. Properties of Sn-Ag-Cu lead free solder with different silver content[J]. Transactions of the China Welding Institution, 2012, 33(6):55-58
    Shnawah D A, Sabri M F M, Badruddin I A, et al. A review on thermal cycling and drop impact reliability of SAC solder jint in portable electronic products[J]. Micro-electronics Reliability, 2012, 52(1):90-99. doi: 10.1016/j.microrel.2011.07.093
    高鹏. 低银SnAgCu系无铅钎料接头冲击和跌落性能研究[D]. 北京工业大学, 2014.
    林金堵, 吴梅珠. 无铅的锡-银-铜焊料的发展-第二代低银含量Sn-Ag-Cu体系[J]. 印制电路信息, 2012, 225(1):67-70 Lin Jindu, Wu Meizhu. The development of the lead-free solder in Sn-Ag-Cu system[J]. Printed Circuit Information, 2012, 225(1):67-70, doi: 10.3969/j.issn.1009-0096.2012.01.017
    符永高, 王宏芹, 王玲, 等. 低银无铅焊料润湿及可靠性能研究[J]. 电子工艺技术, 2010, 31(6):320-323 Fu Yonggao, Wang Hongqin, Wang Ling, et al. Investigation on wetting and reliability of low Ag lead-free solders[J]. Electronics Process Technology, 2010, 31(6):320-323, doi: 10.3969/j.issn.1001-3474.2010.06.003
    Hammad A E. Investigation of microstructure and mechanical properties of novel Sn-0.5Ag-0.7Cu solders containing small amount of Ni[J]. Materials & Design, 2013, 50(17):108-116.
    刘芳. 纳米材料的结构与性质[J]. 光谱实验室, 2011, 28(2):735-738 Liu Fang. Structure and character of nano-materials[J]. Chinese Journal of Spectroscopy Laboratory, 2011, 28(2):735-738, doi: 10.3969/j.issn.1004-8138.2011.02.061
    社长华, 王涛, 甘贵生, 等. 纳米颗粒复合钎料的研究进展[J]. 重庆理工大学学报(自然科学版), 2012, 26(6):36-41 She Changhua, Wang Tao, Gan Guisheng, et al. Research progress on nano-composite solders[J]. Journal of Chongqing University of Technology, 2012, 26(6):36-41, doi: 10.3969/j.issn.1674-8425-B.2012.06.007
    • Related Articles

  • Related Articles

    [1]ZHENG Guangzhen, HAN Hongbiao, WANG Rui, ZHANG Peng. Electrode wobble technology of electro-spark deposition based on orthogonal tests[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2025, 46(3): 43-50, 136. DOI: 10.12073/j.hjxb.20231215001
    [2]LE Jian, LI Fayuan, SHU Zhiheng, ZENG Mingru, ZHANG Hua. Welding current and voltage detection and control method based on visual sensing[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2024, 45(11): 85-89. DOI: 10.12073/j.hjxb.20240705002
    [3]HOU Yujie, HAN Hongbiao, YANG Xin, ZHENG Guangzhen. Development of a closed loop control system for discharge parameters of electric spark deposition[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(9): 53-59. DOI: 10.12073/j.hjxb.20221122003
    [4]LI Mengnan, HAN Hongbiao, LI Shikang, HOU Yujie. Effect of rotating electrode contact force on discharge parameters and material transfer in electric-spark deposition[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(1): 71-77. DOI: 10.12073/j.hjxb.20220206001
    [5]WANG Shun, HAN Hongbiao, LI Shikang, LI Mengnan. Analysis of the influence of cylindrical electrode parameters on electro-spark deposition quality based on orthogonal experiment[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2021, 42(7): 37-43. DOI: 10.12073/j.hjxb.20210131002
    [6]HAN Hongbiao, GUO Jingdi, JIAO Wenqing. Discharge mechanism of electro-spark deposition with rotary electrode[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(5): 67-72. DOI: 10.12073/j.hjxb.2019400129
    [7]HAN hongbiao, LI Xiangyang. Digital control of capacitance charge-discharge pulse in electro-spark deposition power supply[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2014, 35(3): 23-26，70.
    [8]GAO Ying, HAN Jinghua, LOU Liyan, LI Huan. Influence of electrode pressure on Cr12MoV electric-spark depositing YG6 process[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2014, 35(1): 45-48.
    [9]LI Zhenying, DAI Liping, HOU Ming, HE Qiong. Automatic control of open arc surfacing system for the milling roller[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (4): 82-84.
    [10]YANG Li-jun, LI Huan, HU Sheng-gang, LI Jun-yue. Pulsed MIG Welding Inverter Power Source by Spectral and Control System[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2001, (1): 41-44.

  • Cited by

    Periodical cited type(5)

    1. 张仁航，李帅贞，汪认，何建英，许骏，孙晓红，冷康龙. 全熔透与部分熔透十字接头疲劳性能对比分析. 金属加工(热加工). 2021(03): 45-48 .
    2. 周松，查涛，黄研清，安金岚，回丽，王磊. 典型高速列车用6N01铝合金焊接接头的微观组织及疲劳性能. 中国有色金属学报. 2021(05): 1253-1260 .
    3. 杜亚芳，王东坡，刘秀国，龚宝明，邓彩艳. T形接头承载角焊缝根部裂纹扩展角度. 焊接学报. 2021(09): 21-27+98 . 本站查看
    4. 张军，张凤梅，周韶泽. 惯性载荷作用下结构应力法焊接结构抗疲劳性能研究. 大连交通大学学报. 2019(01): 40-45 .
    5. 王苹，米莉艳，于谊飞，董平沙. 7N01铝合金十字接头抗疲劳设计. 焊接学报. 2019(10): 20-24+161-162 . 本站查看

    Other cited types(5)

Catalog

    Get Citation
    XML
    Article views (691) PDF downloads (107) Cited by(10)
    Turn off MathJax
    Article Contents
    Abstract
    References
    Related Articles

    Website Copyright © Editorial Office of Transactions of the China Welding Institution, Welding Journals Publishing HouseTel：0451-86323218Address：No. 2077, Chuangxin Road, Songbei District, Harbin

    Supported by: Beijing Renhe Information Technology Co. Ltd    Baidu Analytics

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return