Research progress on micro/nano joining technologies and failure behaviors in electronic packaging

YANG Dongsheng; ZHANG He; FENG Jiayun; SA Zicheng; WANG Chenxi; TIAN Yanhong

doi:10.12073/j.hjxb.20220702003

TRANSACTIONS OF THE CHINA WELDING INSTITUTION > 2022 > 43(11): 126-136. > DOI: 10.12073/j.hjxb.20220702003

YANG Dongsheng, ZHANG He, FENG Jiayun, SA Zicheng, WANG Chenxi, TIAN Yanhong. Research progress on micro/nano joining technologies and failure behaviors in electronic packaging[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(11): 126-136. DOI: 10.12073/j.hjxb.20220702003

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Research progress on micro/nano joining technologies and failure behaviors in electronic packaging

State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

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Received Date: July 01, 2022
Available Online: December 05, 2022

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Abstract

Abstract

Micro/nano joining are the key technologies in electronic packaging. With the development of electronic products in the direction of miniaturization and lightweight, various advanced micro/nano joining techniques have emerged in an endless flow, but there is still a lack of systematic summary. In this paper, the representative micro-nano bonding technologies are reviewed, including wire bonding, melting micro-bonding, soldering, nano-paste sintering, conductive adhesive bonding, surface-activated bonding and emerging nano joining technology. The failure behaviors of solder joints under thermal, electrical, mechanical and multi-physics coupling load are summarized. In the future, the micro/nano joining technology will be developed in the direction of smaller interconnect size, intelligent interconnect method, green interconnect material and more reliable interconnect solder joint. The failure behavior analysis of solder joints will gradually expand from the study of single load to thermo-electric-mechanical multiple physical field coupling load, which is more suitable for the actual working conditions. With the continuous development of advanced characterization technologies such as synchrotron radiation and 3D X-ray, the study of failure behaviors and mechanisms will also be more accurate.
- electronic packaging,
- micro/nano joining,
- failure behavior,
- reliability,
- multiple field coupling

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References

Tummala R. Fundamentals of microsystems packaging[M]. New York: McGraw-Hill Professional, 2001.

Kaimori S, Nonaka T, Mizogucgi A. The development of Cu bonding wire with oxidation-resistant metal coating[J]. IEEE Transactions on Advanced Packaging, 2006, 29: 227 − 231. doi: 10.1109/TADVP.2006.872999

王星星, 上官林健, 何鹏, 等. 基于熵模型镀锡银钎料钎焊性能的定量表征[J]. 焊接学报, 2020, 41(1): 18 − 22.

Wang Xingxing, Shangguan Linjian, He Peng, et al. Quantitative characterization of brazability for Sn-plated Ag brazing filler metals based on entropy model devices[J]. Transactions of the China Welding Institution, 2020, 41(1): 18 − 22.

杨婉春, 王帅, 祝温泊, 等. 低温烧结纳米铜焊膏的制备及其连接性能分析[J]. 焊接学报, 2018, 39(6): 72 − 76. doi: 10.12073/j.hjxb.2018390152

Yang Wanchun, Wang Shuai, Zhu Wenbo, et al. Preparation and connection performance analysis of solder paste by low-temperature sintering Cu nanoparticles[J]. Transactions of the China Welding Institution, 2018, 39(6): 72 − 76. doi: 10.12073/j.hjxb.2018390152

Hu A, Jolanta JR, Sano T. Joining technology innovations at the macro, micro, and nano levels[J]. Applied Sciences, 2019, 9(17): 3568. doi: 10.3390/app9173568

邹贵生, 闫剑峰, 母凤文. 微连接和纳连接的研究新进展[J]. 焊接学报, 2011, 32(4): 107 − 112,118.

Zou Guisheng, Yan Jianfeng, Mu Fengwen, et al. Recent progress in microjoining and nanojoining[J]. Transactions of The China Welding Institution, 2011, 32(4): 107 − 112,118.

Chen M, Zhang Y, Guo Y, et al. Research on flip-chip bonding process and thermal cycle reliability simulation of 3-D stacked structure[J]. IEEE Transactions on Componentrs Packaging and Manufacturing Technology, 2022, 12(1): 51 − 58. doi: 10.1109/TCPMT.2021.3127157

Che F, Wai L, Chai T. Failure mode and mechanism analysis for Cu wire bond on Cu/low-k chip by wire pull test and finite-element analysis[J]. IEEE Transactions on Device and Materials Reliability, 2018, 18: 163 − 172. doi: 10.1109/TDMR.2018.2808348

邹军, 谢昶. 多芯片组件中金丝金带键合互连的特性比较[J]. 微波学报, 2010, 26(增刊): 378 − 380.

Zou Jun, Xie Chang. Recent progress in microjoining and nanojoining[J]. Journal of Microwaves, 2010, 26(supplement): 378 − 380.

王尚, 王凯枫, 张贺, 等. 射频器件超细引线键合工艺及性能研究[J]. 机械工程学报, 2021, 57(22): 201 − 208. doi: 10.3901/JME.2021.22.201

Wang Shang, Wang Kaifeng, Zhang He, et al. Study on ultrafine wire bonding and performance of radio frequency devices[J]. Journal of Mechanical Engineering, 2021, 57(22): 201 − 208. doi: 10.3901/JME.2021.22.201

王尚, 马竟轩, 杨东升, 等. 射频器件超细引线键合射频性能仿真[J]. 焊接学报, 2021, 42(10): 1 − 7.

Wang Shang, Ma Jingxuan, Yang Dongsheng, et al. Research on the RF performance simulation of ultra-fine wire bonding of RF devices[J]. Transactions of the China Welding Institution, 2021, 42(10): 1 − 7.

Norrdin I H W, Okamoto Y, Okada A, et al. Effect of focusing condition on molten area characteristics in micro-welding of borosilicate glass by picosecond pulsed laser[J]. Applied Physics, A. Materials Science & Processing, 2016, 122(5): 492.

程战, 郭伟, 刘磊, 等. 石英玻璃与硅的飞秒激光微连接及其接头性能研究[J]. 中国激光, 2015, 42(9): 225 − 231.

Cheng Zhan, Guo Wei, Liu Lei, et al. Mechanical properties of microweld of silica glass to silicon by femtosecond laser[J]. Chinese Journal of Laser, 2015, 42(9): 225 − 231.

Huang Y D, Pequegnat A, Zou G S, et al. Crossed-wire laser microwelding of Pt-10 Pct Ir to 316 LVM stainless steel: Part II. effect of orientation on joining mechanism[J]. Metallurgical and Materials Transactions A-Physical Metallurgy and Materials Science, 2012, 43A: 1234 − 1243.

Zou G, Huang Y, Pequegnat A, et al. Crossed-wire laser microwelding of Pt-10 Pct Ir to 316 low-carbon vacuum melted stainless steel: Part I. mechanism of joint formation[J]. Metallurgical and Materials Transactions A-Physical Metallurgy and Materials Science, 2012, 43A: 1223 − 1233.

陈伟彦, 张延松. 太阳能电池互连片平行间隙电阻焊工艺优化[J]. 机械设计与研究, 2019, 35(5): 75 − 79. doi: 10.13952/j.cnki.jofmdr.2019.0279

Chen Weiyan, Zhang Yansong. Study on process optimization of parallel gap resistance welding of solar cell and interconnector based on temperature field analysis[J]. Machine Design and Research, 2019, 35(5): 75 − 79. doi: 10.13952/j.cnki.jofmdr.2019.0279

Zhang W, Cong S, Wen Z, et al. Experiments and reliability research on bonding process of micron copper wire and nanometer gold layer[J]. The International Journal of Advanced Manufacturing Technology, 2017, 92: 4073 − 4080. doi: 10.1007/s00170-017-0490-z

Zhang H, Wang S, Wu B, et al. Ultrafast parallel micro-gap resistance welding of an AuNi9 microwire and Au microlayer[J]. Micromachines, 2021, 12(1): 51. doi: 10.3390/mi12010051

Wang S, Zhang H, Li Y, et al. Phase transformation behavior of Al-Au-Cu intermetallic compounds under ultra-fast micro resistance bonding process[J]. Materials Characterization, 2021, 180: 111401. doi: 10.1016/j.matchar.2021.111401

Cong S, Zhang W, Zhang H, et al. Growth kinetics of (Cu_xNi_{1- x})₆Sn₅ intermetallic compound at the interface of mixed Sn63Pb37/SAC305 BGA solder joints during thermal aging test[J]. Materials Research Express, 2021, 8: 106301. doi: 10.1088/2053-1591/ac3168

Rajendran S, Jung D, Jung J. Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn-3.0Ag-0.5Cu solder using 1608 chip capacitor/ENIG joints[J]. Journal of Materials Science: Materials in Electronics, 2022, 33: 3687 − 3710. doi: 10.1007/s10854-021-07562-2

Tian Y, Wang C, Zhang X, et al. Interaction kinetics between PBGA solder balls and Au/Ni/Cu metallisation during laser reflow bumping[J]. Soldering & Surface Mount Technology, 2003, 15(2): 17 − 21.

Tian Y, Wang C. Formation and change of AuSn₄ compounds at interface between PBGA solder ball and Au/Ni/Cu metallization during laser and infrared reflow soldering[J]. Acta Metallurgica Sinica (English Letters), 2004, 17(2): 199 − 204.

Yao P, Li X, Liang X B, et al. Investigation of soldering process and interfacial microstructure evolution for the formation of full Cu₃Sn joints in electronic packaging[J]. Materials Science in Semiconductor Processing, 2017, 58: 39 − 50. doi: 10.1016/j.mssp.2016.11.019

Li M, Li Z, Xiao Y, et al. Rapid formation of Cu/Cu₃Sn/Cu joints using ultrasonic bonding process at ambient temperature[J]. Applied Physics Letters, 2013, 102(9): 094104. doi: 10.1063/1.4794684

Feng J, Hang C, Tian Y, et al. Effect of electric current on grain orientation and mechanical properties of Cu-Sn intermetallic compounds joints[J]. Journal of Alloys and Compounds, 2018, 753: 203 − 211. doi: 10.1016/j.jallcom.2018.04.041

Liu B, Tian Y, Wang C, et al. Ultrafast formation of unidirectional and reliable Cu₃Sn-based intermetallic joints assisted by electric current[J]. Intermetallics, 2017, 80: 26 − 32. doi: 10.1016/j.intermet.2016.10.004

Liu B, Tian Y, Feng J, et al. Enhanced shear strength of Cu–Sn intermetallic interconnects with interlocking dendrites under fluxless electric current-assisted bonding process[J]. Journal of Materials Science, 2017, 52: 1943 − 1954. doi: 10.1007/s10853-016-0483-6

Schwarzbauer H, Kuhnert R. Novel large area joining technique for improved power device performance[J]. IEEE Transactions on Industry Applications, 1991, 27(1): 93 − 95. doi: 10.1109/28.67536

Dai Y, Ng M, Anantha P, et al. Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects[J]. Applied Physics Letters, 2016, 108: 263103. doi: 10.1063/1.4954966

Tian Y, Jiang Z, Wang C, et al. Sintering mechanism of the Cu–Ag core–shell nanoparticle paste at low temperature in ambient air[J]. RSC Advances, 2016, 6: 91783 − 91790. doi: 10.1039/C6RA16474A

Liu X, Liu W, Wang C, et al. Optimization and modeling for one-step synthesis process of Ag-Cu nano-particles using DOE methodology[J]. Journal of Materials Science: Materials in Electronics, 2016, 27: 4265 − 4274. doi: 10.1007/s10854-016-4292-0

Zhong Y, An R, Wang C, et al. Low temperature sintering Cu₆Sn₅ nanoparticles for superplastic and super-uniform high temperature circuit interconnections[J]. Small, 2015, 11: 4097 − 4103. doi: 10.1002/smll.201500896

Guo L, Liu W, Ji X, et al. Facile synthesis of Cu₁₀Sn₃ nanoparticles and their sintering behavior for power device packaging[J]. Results in Materials, 2021, 10: 100187. doi: 10.1016/j.rinma.2021.100187

Jia Q, Zou G, Zhang H, et al. Sintering mechanism of Ag-Pd nanoalloy film for power electronic packaging[J]. Applied Surface Science, 2021, 554: 149579. doi: 10.1016/j.apsusc.2021.149579

付善灿. 纳米银焊膏无压低温烧结连接方法的绝缘栅双极型晶体管(IGBT)模块封装应用研究[D]. 天津: 天津大学, 2016.

Fu Shancan. Research on application of insulated gate bipolar transistor (IGBT) module fabrication by pressureless low temperature sintering of nanosilver paste[D]. Tianjin: Tianjin University, 2016.

Zhang Z, Chen C, Suetake, et al. Pressureless and low-temperature sinter-joining on bare Si, SiC and GaN by a Ag flake paste[J]. Scripta Materialia, 2021, 198: 113833. doi: 10.1016/j.scriptamat.2021.113833

黄圆, 杭春进, 田艳红, 等. 纳米铜银核壳焊膏脉冲电流快速烧结连接铜基板研究[J]. 机械工程学报, 2019, 55(24): 51 − 56. doi: 10.3901/JME.2019.24.051

Huang Yuang, Hang Chunjin, Tian Yanhong, et al. Rapid sintering of nano copper-silver core-shell paste and interconnection of copper substrates by pulse current[J]. Journal of Mechanical Engineering, 2019, 55(24): 51 − 56. doi: 10.3901/JME.2019.24.051

Ji H, Zhou J, Liang M, et al. Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging[J]. Ultrasonics Sonochemistry, 2018, 41: 375 − 381. doi: 10.1016/j.ultsonch.2017.10.003

Liu W, Wang Y, Zheng Z, et al. Laser sintering mechanism and shear performance of Cu-Ag-Cu joints with mixed bimodal size Ag nanoparticles[J]. Journal of Materials Science: Materials in Electronics, 2019, 30: 7787 − 7793. doi: 10.1007/s10854-019-01094-6

Liu H, Ma R, Zhao D, et al. Application of silver nanoparticles in electrically conductive adhesives with silver micro flakes[J]. China Welding, 2022, 31(2): 23 − 28.

Wen J, Tian Y, Hang C, et al. Fabrication of novel printable electrically conductive adhesives (ECAs) with excellent conductivity and stability enhanced by the addition of polyaniline nanoparticles[J]. Nanomaterials, 2019, 9(7): 960. doi: 10.3390/nano9070960

Cao G, Cui H, Wang L, et al. Highly conductive and highly dispersed polythiophene nanoparticles for fabricating high-performance conductive adhesives[J]. ACS Applied Electronic Materials, 2020, 2: 2750 − 2759. doi: 10.1021/acsaelm.0c00457

马跃辉. PS/金属核壳结构复合微球的制备及其在各向异性导电胶膜上的应用[D]. 上海: 东华大学, 2013.

Ma Yuehui. Preparation of polystyrene/metal core/shell microspheres and their application in anisotropic conductive film[D]. Shanghai: Donghua University, 2013.

王正家. ACA互连的多因素作用分析与性能优化[D]. 武汉: 华中科技大学, 2010.

Wang Zhengjia. Analysis of anisotropic conductive adhesive interconnection under multi-factors influence and optimization for its performance [D]. Wuhan: Huazhong University of Science and Technology, 2010.

陈显才. 倒装键合中各向异性导电胶微互连电阻形成机理研究[D]. 武汉: 华中科技大学, 2012.

Chen Xiancai. The research on the formation mechanism of micro ACA joints resistance in the flip chip bonding[D]. Wuhan: Huazhong University of Science and Technology, 2012.

Bo G, Yu H, Ren L, et al. Gallium-indium-tin liquid metal nanodroplet-based anisotropic conductive adhesives for flexible integrated electronics[J]. ACS Applied Nano Materials, 2021, 4: 550 − 557. doi: 10.1021/acsanm.0c02870

Wang C, Wang Y, Tian Y, et al. Room-temperature direct bonding of silicon and quartz glass wafers[J]. Applied Physics Letters, 2017, 110: 221602. doi: 10.1063/1.4985130

张贺, 王尚, 冯佳运, 等. 金属/非金属纳米线连接及应用研究进展[J]. 机械工程学报, 2022, 58(2): 76 − 87.

Zhang He, Wang Shang, Feng Jiayun, et al. Recent progress of metal/nonmetal nanowire joining technology and its applications[J]. Journal of Mechanical Engineering, 2022, 58(2): 76 − 87.

Lin L, Liu L, Peng P, et al. In situ nanojoining of Y- and T-shaped silver nanowires structures using femtosecond laser radiation[J]. Nanotechnology, 2016, 27: 125201. doi: 10.1088/0957-4484/27/12/125201

Zhang H, Tian Y, Wang S, et al. Highly stable flexible transparent electrode via rapid electrodeposition coating of Ag-Au alloy on copper nanowires for bifunctional electrochromic and supercapacitor device[J]. Chemical Engineering Journal, 2020, 399(20): 125075.

Huang Y, Tian Y, Hang C, et al. Self-limited nanosoldering of silver nanowires for high-performance flexible transparent heaters[J]. ACS Applied Materials & Interfaces, 2019, 11: 21850 − 21858.

Ding S, Zhang S, Tong X, et al. Room-temperature nanojoining of silver nanowires by graphene oxide for highly conductive flexible transparent electrodes[J]. Nanotechnology, 2022, 34: 045201.

Gao L, Liu Z, Li C. Failure mechanisms of SAC/Fe-Ni solder joints during thermal cycling[J]. Journal of Electronic Materials, 2017, 46: 5338 − 5348. doi: 10.1007/s11664-017-5554-1

Mattila T, Kivilahti J. The role of recrystallization in the failure of SnAgCu solder interconnections under thermomechanical loading[J]. IEEE Transactions on Components and Packaging Technologies, 2010, 33: 629 − 635. doi: 10.1109/TCAPT.2010.2051268

Ji X, An Q, Xia Y, et al. Maximum shear stress-controlled uniaxial tensile deformation and fracture mechanisms and constitutive relations of Sn-Pb eutectic alloy at cryogenic temperatures[J]. Materials Science and Engineering: A, 2021, 819: 141523. doi: 10.1016/j.msea.2021.141523

Tian R, Hang C, Tian Y, et al. Interfacial intermetallic compound growth in Sn-3Ag-0.5Cu/Cu solder joints induced by stress gradient at cryogenic temperatures[J]. Journal of Alloys and Compounds, 2019, 800: 180 − 190. doi: 10.1016/j.jallcom.2019.05.295

Chen C, Tong H, Tu K. Electromigration and thermomigration in Pb-Free flip-chip solder joints[J]. Annual Review of Materials Research, 2010, 40: 531 − 555. doi: 10.1146/annurev.matsci.38.060407.130253

Chang Y, Cheng Y, Xu F, et al. Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling[J]. Acta Materialia, 2016, 117: 100 − 110. doi: 10.1016/j.actamat.2016.06.059

Liu B, Tian Y, Qin J, et al. Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress[J]. Journal of Materials Science: Materials in Electronics, 2016, 27: 11583 − 11592. doi: 10.1007/s10854-016-5289-4

Luan J, Tee T, Pek E, et al. Dynamic responses and solder joint reliability under board level drop test[J]. Microelectronics Reliability, 2007, 47: 450 − 460. doi: 10.1016/j.microrel.2006.05.012

Marjamaki P, Mattila T T, Kivilahti J K. A comparative study of the failure mechanisms encountered in drop and large amplitude vibration tests[C]//56th Electronic Components and Technology Conference 2006. San Diego, CA, USA, 2006: 95-101.

Liu F, Meng G. Random vibration reliability of BGA lead-free solder joint[J]. Microelectronics Reliability, 2014, 54: 226 − 232. doi: 10.1016/j.microrel.2013.08.020

李跃, 田艳红, 丛森, 等. PCB组装板多器件焊点疲劳寿命跨尺度有限元计算[J]. 机械工程学报, 2019, 55(6): 54 − 60. doi: 10.3901/JME.2019.06.054

Li Yue, Tian Yanhong, Cong Sen, et al. Multi-scale finite element analysis into fatigue lives of various component solder joints on printed circuit board[J]. Journal of Mechanical Engineering, 2019, 55(6): 54 − 60. doi: 10.3901/JME.2019.06.054

Feng D, Wang F, Li D, et al. Atomic migration on Cu in Sn-58Bi solder from the interaction between electromigration and thermomigration[J]. Materials Research Express, 2019, 6: 046301. doi: 10.1088/2053-1591/aaf91c

Ye H, Basaran C, Hopkins D. Thermomigration in Pb-Sn solder joints under joule heating during electric current stressing[J]. Applied Physics Letters, 2003, 82: 1045 − 1047. doi: 10.1063/1.1554775

李望云. 电-热-力耦合场作用下无铅微焊点的变形和断裂行为及其尺寸效应研究[D]. 广州: 华南理工大学, 2017.

Li Wangyun. Deformation and fracture behavior of microscale lead-free solder joints under electro-thermo-mechanical coupled loads and their size effects[D]. Guangzhou: South China University of Technology, 2017.

李胜利, 任春雄, 杭春进, 等. 极端热冲击和电流密度耦合Sn-3.0Ag-0.5Cu焊点组织演变[J]. 机械工程学报, 2022, 58(2): 291 − 299. doi: 10.3901/JME.2022.02.291

Li Shengli, Ren Chunxiong, Hang Chunjin, et al. Microstructure evolution of Sn-3.0Ag-0.5Cu solder joints under extreme temperature changes and current stressing[J]. Journal of Mechanical Engineering, 2022, 58(2): 291 − 299. doi: 10.3901/JME.2022.02.291

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