Research on reliability of CCGA reinforcement process for aerospace electronic products

WANG Haichao; PENG Xiaowei; GUO Fan; DING Yingjie; CHEN Qiang

doi:10.12073/j.hjxb.20210907001

TRANSACTIONS OF THE CHINA WELDING INSTITUTION > 2022 > 43(7): 102-107. > DOI: 10.12073/j.hjxb.20210907001

WANG Haichao, PENG Xiaowei, GUO Fan, DING Yingjie, CHEN Qiang. Research on reliability of CCGA reinforcement process for aerospace electronic products[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(7): 102-107. DOI: 10.12073/j.hjxb.20210907001

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Research on reliability of CCGA reinforcement process for aerospace electronic products

1.
Shanghai Aerospace Control Technology Institute, Shanghai, 201100, China
2.
Tianjin University, Tianjin, 300072, China

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Received Date: September 06, 2021
Available Online: April 28, 2022

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Abstract

Abstract

Ceramic column grid array packaging device (CCGA) are widely used in aerospace electronic products. The assembly and welding quality of CCGA is closely related to the device size and reinforcement process. This paper studied the effects of primted circurt board (PCB) constraints and CCGA reinforcement process on solder joint reliability by experiment and numerical simulation. The results show that optimized PCB restraint and using EC-2216 epoxy adhesive to strengthen CCGA can significantly reduce solder joint stress during random vibration. After reliability tests, using a small amount of EC-2216 epoxy adhesive to strengthen CCGA meets the reliability requirements of QJ 3086A—2016, the vibration resistance of solder joint is improved, and it has little influence on the thermal fatigue resistance. With the increase of epoxy adhesive amount, the thermal fatigue resistance of solder joints decrease significantly, and the high failure risk of solder joints exists in the service environment with large temperature difference. Under the condition of fully optimizing PCB board level constraints, using GD414 silicone rubber to reinforce the CCGA meets the high reliability assembly requirements of aerospace electronics. The above results provide reference for the reinforcement process of CCGA.
- ceramic column grid array packaging device,
- mechanical stress,
- thermal fatigue failure,
- reliability

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References (11)

References

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Research on reliability of CCGA reinforcement process for aerospace electronic products