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SHEN Zhongbao, QIU Ranfeng, SHI Hongxin, MA Hengbo. Growth mechanism of intermetallic compounds at the solid-state joining interface of aluminum/steel[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(6): 58-63. DOI: 10.12073/j.hjxb.2019400155
Citation: SHEN Zhongbao, QIU Ranfeng, SHI Hongxin, MA Hengbo. Growth mechanism of intermetallic compounds at the solid-state joining interface of aluminum/steel[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(6): 58-63. DOI: 10.12073/j.hjxb.2019400155
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Growth mechanism of intermetallic compounds at the solid-state joining interface of aluminum/steel

  • 1.

    Henan University of Science and Technology, Luoyang 471023, China

  • 2.

    Henan University of Science and Technology, Luoyang 471023, China;Collaborative Innovation Center of Nonferrous Metals, Luoyang 471003, China

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  • Received Date: January 29, 2018
    Graphical Abstract
    • Abstract
  • The explosive welded Al/Q235 joint was annealed under various heating time and temperature keeping the joint stay at solid state condition. The interfacial reaction layer feature was analyzed and the effects of heating temperature and time on the thickness of reaction layer were investigated, the growth of intermetallic compound at the joining interface was studied. The interfacial reaction layer consisting of Fe2Al5 adjacent to steel and Fe4Al13 adjacent to aluminum formed in the joining interface. The thickness of intermetallic compound increased with the longer of heating time. The results show that the growth of intermetallic compound satisfies the parabolic rule and that the growth active energy is 33.26 kJ/mol.
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    • References (11)
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