Advanced Search
HUANG Chunyue, XIONG Guoji, LIANG Ying, SHAO Liangbin, HUANG Wei, LI Tianming. Study on stress distribution of 3D-TSV interconnect structure under random vibration load[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(11): 17-20.
Citation: HUANG Chunyue, XIONG Guoji, LIANG Ying, SHAO Liangbin, HUANG Wei, LI Tianming. Study on stress distribution of 3D-TSV interconnect structure under random vibration load[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(11): 17-20.
shu

Study on stress distribution of 3D-TSV interconnect structure under random vibration load

  • 1.

    School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin 541004, China

  • 2.

    Department of Electronic Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu 610021, China

  • 3.

    Department of Automobile and Power Engineering, Guilin University of Aerospace Technology, Guilin 541004, China

More Information
  • Received Date: February 13, 2014
    Graphical Abstract
    • Abstract
  • The 3D finite element analysis models of 3D-TSV interconnect structure were developed. By using ANSYS, the finite element analysis of the stress distribution in the model was performed under the condition of thermal-structure coupling. The TSV height and the TSV diameter, the micro-bump height and the micro-bump diameter were selected as four key configuration parameters, combinations were designed. By using an L16(45) orthogonal array the 3D-TSV which have 16 different configuration parameters' levels. The maximum stress values within 3D-TSV were obtained. Variance analysis was performed based on the values of stress. The results show that the TSV height has highly significant impact on the stress of 3D-TSV under random vibration with 99% confidence. The TSV height, the TSV diameter, the micro-bump diameter and the micro-bump height affect the stress of 3D-TSV in a descending order. The single-factor analysis of variance shows that the stress and strain in TSV interconnect structure increase with the height of TSV.
    • FullText(HTML)
    • References (8)
  • Banijamali B, Ramalingam S, Liu H, et al. Outstanding and innovative reliability study of 3D TSV interposer and fine pitch solder micro-bumps[C]// IEEE 62nd Electronic Components and Technology Conference, San Diego, 2012: 309-314.
    Thakur S, Nakanekar S, Kaisare A, et al. Design for reliability of stacked die package using TSV technology[C]// ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, Portland, 2011: 75-82.
    Frank T, Moreau S, Chappaz C, et al. Reliability of TSV interconnects: electro-migration, thermal cycling, and impact on above metal level dielectric[J]. Microelectronics Reliability, 2013, 53(1): 17-29.
    俞箭飞, 江五贵. 穿透硅通孔互连结构的湿-热应力有限元分析[J]. 半导体技术, 2012, 37(11): 70-74. Yu Jianfei, Jiang Wugui. Finite element analysis of the thermal-hygroscopic stress of the through silicon vias (TSV) interconnect structure[J]. Semiconductor Technology, 2012, 37(11): 70-74.
    安 彤, 秦 飞, 武 伟, 等. TSV 转接板硅通孔的热应力分析[J]. 工程力学, 2013, 30(7): 262-269. An Tong, Qin Fei, Wu Wei, et al. Analysis of thermal stress in through silicon vias of interposer[J]. Engineering Mechanics, 2013, 30(7): 262-269.
    黄春跃, 吴兆华, 周德俭. 热冲击条件下1.27 mm引脚间距塑封球栅阵列器件焊点可靠性测试与分析[J]. 焊接学报, 2005, 26(9): 31-34. Huang Chunyue, Wu Zhaohua, Zhou Dejian. Reliability test and analysis of 1.27 mm pitch plastic ball grid array soldered joint under thermal shock[J]. Transactions of the China Welding Institution, 2005, 26(9): 31-34.
    田艳红, 王 宁, 杨东升, 等. 三维封装芯片键合IMC焊点应力分析及结构优化[J]. 焊接学报, 2012, 33(8): 17-20. Tian Yanhong, Wang Ning, Yang Dongsheng, et al. Stress analysis and structure optimization of IMC joints in 3D package[J]. Transactions of the China Welding Institution, 2012, 33(8): 17-20.
    陶博浩, 李 红, 宋永伦, 等. 电阻点焊冷轧DP600双相钢焊接接头性能的正交试验分析[J]. 焊接学报, 2013, 34(6): 81-84. Tao Bohao, Li Hong, Song Yonglun, et al. Analysis of orthogonal test of properties of dual-phase DP600 steel resistance spot welded joint[J]. Transactions of the China Welding Institution, 2013, 34(6): 81-84.
    • Related Articles

  • Related Articles

    [1]ZHONG Pu, LI Liangyu, REN Guochun, WANG Tianqi, GUO Dongbo. "Γ" shaped arc and its promotion method in Tri-Arc dual wire welding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2024, 45(2): 54-60. DOI: 10.12073/j.hjxb.20230827001
    [2]LI Yuanbo, LI Xiao, SHI Quanfu, LIU Jing, LI Kai. Differential analysis for temperature distribution diagnostics of arc current-carrying region with low disturbance electrostatic probe[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(5): 26-30. DOI: 10.12073/j.hjxb.20170506
    [3]LI Yuanbo, LU Tian, ZHU Liang, SUN Zhe. Electrostatic probe analysis of current-carrying region of sheet slanting tungsten electrode arc[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(12): 22-26.
    [4]LI Yuanbo, ZHU Liang. Electrostatic probe analysis of current-carrying region in constricting TIG arc with insulating sheet[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2014, 35(7): 55-58.
    [5]HUANG Yong, WANG Xinxin, QU Huaiyu, FAN Ding. Effects of arc parameters on arc anode current density of coupling AA-TIG arc[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2014, 35(2): 5-9.
    [6]FENG Tao, WANG Yinzhen, SUN Yuwei, YI Dongxu, LOU Songnian. Analysis of exposed particles and mechanical performance of brazing joints of SiCp/2024Al composites[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (10): 101-104.
    [7]DU Huayun, AN Yanli, WEI Yinghui, WANG Wenxian, FAN Ding. Effect of flow rate and arc length changes on velocity and temperature field of TIG arc[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (5): 73-76.
    [8]ZHENG Jun, LIU Zhengwen, CHEN Lianglei, CHENG Bai, PAN Jiluan. Arc length control study for crawl-type electrogas arc welding robot[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (7): 105-108.
    [9]SUN Zhen-guo, CHEN Nian, CHEN Qiang, XU Xu-jiong, LUO Deng-feng, LIAO Jian-xiong. A New Arc Length Tracing Method for Precison Pulse TIG Welding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2001, (1): 45-48.
    [10]Fu Xisheng, Li Ye, Wang Xiabing. Sability of wire extension and arc length with GMA welding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1995, (2): 100-105.

  • Cited by

    Periodical cited type(5)

    1. 周利杰，郝瑞林，蔡国庆，刘辉，宿世界. 超声波键合压力自适应平衡装置设计与实验研究. 中国机械工程. 2023(16): 2009-2015 .
    2. 郭栋，乔冠尧，李亮，何勍. 兆赫频超声塑料焊接温度场的数值模拟. 辽宁工业大学学报(自然科学版). 2022(06): 378-381 .
    3. 严波，丁浩亮. 热塑性塑料超声波焊接的热力过程数值模拟. 塑性工程学报. 2020(05): 33-40 .
    4. 张增焕，苏轩，李昊，陶汪，王玉华. 导能筋形状对超声波焊接CF/PEEK接头组织和力学性能的影响. 焊接学报. 2019(09): 93-98+165 . 本站查看
    5. 冯雨. 35kHz超声波塑料焊接机械结构的研制. 时代农机. 2018(06): 79 .

    Other cited types(5)

Catalog

    Get Citation
    PDF
    XML
    Article views (358) PDF downloads (223) Cited by(10)
    Turn off MathJax
    Article Contents
    Abstract
    References
    Related Articles

    Website Copyright © Editorial Office of Transactions of the China Welding Institution, Welding Journals Publishing HouseTel：0451-86323218Address：No. 2077, Chuangxin Road, Songbei District, Harbin

    Supported by: Beijing Renhe Information Technology Co. Ltd    Baidu Analytics

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return