Study on stress distribution of 3D-TSV interconnect structure under random vibration load

The 3D finite element analysis models of 3D-TSV interconnect structure were developed. By using ANSYS, the finite element analysis of the stress distribution in the model was performed under the condition of thermal-structure coupling. The TSV height and the TSV diameter, the micro-bump height and the micro-bump diameter were selected as four key configuration parameters, combinations were designed. By using an L₁₆(4⁵) orthogonal array the 3D-TSV which have 16 different configuration parameters' levels. The maximum stress values within 3D-TSV were obtained. Variance analysis was performed based on the values of stress. The results show that the TSV height has highly significant impact on the stress of 3D-TSV under random vibration with 99% confidence. The TSV height, the TSV diameter, the micro-bump diameter and the micro-bump height affect the stress of 3D-TSV in a descending order. The single-factor analysis of variance shows that the stress and strain in TSV interconnect structure increase with the height of TSV.