Citation: | LIANG Ying, LIN Xunchao, HUANG Chunyue, SHAO Liangbin, ZHANG Xin. Analysis of signal integrity of UBM and bump interconnection[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(8): 9-12. |
韦何耕,黄春跃,梁颖,等.热循环加载条件下PBGA叠层无铅焊点可靠性分析[J].焊接学报, 2013, 34(10):91-94. Wei Hegeng, Huang Chunyue, Liang Ying, et al. Reliability analysis of plastic ball grid array double-bump lead-free solder joint under thermal cycle[J]. Transactions of the China Welding Institution, 2013, 34(10):91-94.
|
黄春跃,吴兆华,周德俭.热冲击条件下1.27 mm引脚间距塑封球栅阵列器件焊点可靠性测试与分析[J].焊接学报, 2005, 26(9):31-34. Huang Chunyue, Wu Zhaohua, Zhou Dejian. Reliability test and analysis of 1.27 mm pitch plastic ball grid array soldered joint under thermal shock[J]. Transactions of the China Welding Institution, 2005, 26(9):31-34.
|
薛明阳,卫国强,金亮.不同应变速率下BGA焊球剪切断裂试验与模拟分析[J].焊接学报, 2014, 35(3):45-48. Xue Mingyang, Wei Guoqiang, Jin Liang, et al. Experimental and simulation analysis on shear fracture for BGA solder ball under different strain rates[J]. Transactions of the China Welding Institution, 2014, 35(3):45-48.
|
Li J, Han L, Duan J, et al. Interface mechanism of ultrasonic flip chip bonding[J]. Applied Physics Letters, 2007, 90:242902-1-242902-3.
|
谢拥军,王鹏. Ansoft HFSS基础及应用[M].西安:西安电子科技大学出版社, 2007.
|
陈波,陈焱,谷德君.凸点下金属层湿法刻蚀与凸点底切的控制[J].半导体技术, 2009, 34(12):1209-1212. Chen Bo, Chen Yan, Gu Dejun. Wet UBM etching and bump undercutcontrol[J]. Semiconductor Technology, 2009, 34(12):1209-1212.
|
黄春跃,郭广阔,梁颖,等.基于HFSS的高速互连BGA焊点信号完整性仿真分析[J].系统仿真学报, 2014, 26(12):2985-2990. Huang Chunyue, Guo Guangkuo, Liang Ying, et al. Analysis of signal integrity of the high-speed interconnects BGA solder joint based on HFSS[J]. Journal of System Simulation, 2014, 26(12):2985-2990.
|
薛栋民,廖广兰,史铁林.铝/镍/铜UBM厚度对SnAgCu焊点的力学性能及形貌影响[J].半导体光电, 2014, 35(2):278-281. Xue Dongmin, Liao Guanglan, Shi Tielin. Effects of UBM thickness on shear strength and morphology in solder jointsbetween SnAgCu solder and Al/Ni/Cu thin films[J]. Semiconductor Optoelectronics, 2014, 35(2):278-281.
|
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