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CHEN Cheng, XUE Songbai, YANG Jingqiu, YE Huan, LI Yang. Effect of Pr on whisker growth of Sn-Zn-Ga lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (7): 69-72.
Citation: CHEN Cheng, XUE Songbai, YANG Jingqiu, YE Huan, LI Yang. Effect of Pr on whisker growth of Sn-Zn-Ga lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (7): 69-72.
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Effect of Pr on whisker growth of Sn-Zn-Ga lead-free solder

  • 1.

    College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China

  • 2.

    Harbin Welding Institute, Harbin 150000, China

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  • Received Date: March 11, 2012
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    • Abstract
  • Relation between Sn whisker growth and the amount of rare earth was studied.The influence factor of Sn whisker growth was initially analyzed, especially in the aspect of aging time and cooling rate.Furthermore, the growth mechanism of Sn whisker growth on the surface of the solder was initially discussed.The experimental results show that with the addition of 0.7% Pr to Sn-Zn-Ga-xPr solder, Sn whisker could spontaneously grow on the surface of the solder only after aging 12 hours.With the increasing of aging time, the length of Sn whisker grew rapidly, which could reach the critical value of failure after aging about 45 days.It was also found that the growth morphologies of Sn whisker with different cooling rates have diversity.Finally, the mechanism for whisker growth in Sn-Zn-Ga-xPr was initially discussed.
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