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ZHANG Guoshang, JING Hongyang, XU Lianyong, WEI Jun, . Thermomechanical characterization of 80Au/20Sn solder using nanoindentation[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (9): 53-56.
Citation: ZHANG Guoshang, JING Hongyang, XU Lianyong, WEI Jun, . Thermomechanical characterization of 80Au/20Sn solder using nanoindentation[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (9): 53-56.
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Thermomechanical characterization of 80Au/20Sn solder using nanoindentation

  • 1.

    School of Material Science and Engineering, Tianjin University, Tianjin 300072, China

  • 2.

    Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore 638075, Singapore

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  • Received Date: November 13, 2008
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    • Abstract
  • The thermomechanical behaviors of the 80Au/20Sn solder at 25, 75, 125 and 200℃ were investigated by constant loading rate/load nanoindentation tests.The results showed that the load-displacement curves depended on the loading rate, applied load and temperature strongly.The loading rate sensitivity, obvious size effect, piling up at 125 and 200℃ were observed.The elastic modulus and hardness were obtained using the Oliver-Pharr method after the contact area was modified based on the semi-ellipse method.The elastic modulus and hardness increase rapidly with the improved loading rate then reach an approximately steady stage, decrease initially as the increased load ultimately attain a steady-state value, decline greatly with the higher temperature.
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