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TAI Feng, GUO Fu, SHEN Hao, Han Mengting. Effect of heating rate on microstructure and mechanical properties of composite solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (9): 79-82.
Citation: TAI Feng, GUO Fu, SHEN Hao, Han Mengting. Effect of heating rate on microstructure and mechanical properties of composite solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (9): 79-82.
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Effect of heating rate on microstructure and mechanical properties of composite solder joints

  • College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China

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  • Received Date: November 18, 2007
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  • The different soldering processes condition has been found to play a significant role in determining the intermetallic compound (IMC)morphology and dimension in some metallic particulate (such as Ni, Ag, and Cu metallic particles)reinforced composite solders, and the morphology and dimension of IMCs around the reinforced particulate have an influence on mechanical propertirs of composite solder joints.The current study was to research the morphology of the IMC formed around the metallic Cu reinforced particulates incorporated in the Sn-3.5Ag solder by mechanically, and the mechanical property of composite solder joints.Experimental results indicated that the different heating rate have no influence on the morphology of the IMCs formed around Cu reinforced particulate, but just have effect on the thickness of the IMCs and mechanical property of composite solder joints.The relationship between dimension of IMCs and mechanical property in different processing condition was established.
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