Diffusion bonding of TC4/Ni/QAl10-3-1.5

TC4 and QAl10-3-1.5 were diffusion-bonded with Ni interlayer. The diffusion-bonded joints were evaluated by scanning electron microscopy(JEOL JSM6700F) and its attaching energy dispersive spectroscopy(EDS). Intermetallic compounds at the interface were detected vie X-ray diffraction(XRD) and microhardness tests and tensile testings were done to evaluate the properties of bond joints. The results indicated that TC4 and QAl10-3-1.5 with Ni interlayer were bonded firmly under the condition of 870℃ temperature,10MPa bond stress and 60min holding time, and the bond strength was up to 325MPa, furthermore, various reaction bands appeared in the diffusion zone,and NiTi phase,(NiTi+ Ni₃Ti)phase and Ni(Cu) solid solution were produced at the interface zone.